tag: 3D-IC

Experts at the Table: Stacking the Deck
By Ed Sperling - 23 Aug, 2012 - Comments: 0

By Ann Steffora Mutschler System-Level Design sat down to discuss challenges to 3D-IC adoption with Samta Bansal, product marketing for applied silicon realization in strategy and market development at Cadence; Carey Robertson, product marketing director at Mentor Graphics; Karthik Chandrasekar, member of technical staff in IC Design at Altera; and Herb Reiter, president of EDA2ASIC Consulting... » read more

Experts At The Table: Stacked Die Reality Check
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down with Sunil Patel, principal member of the technical staff for package technology at GlobalFoundries; Steve Pateras, product marketing director at Mentor Graphics; Steve Smith, senior director of platform marketing at Synopsys; Thorsten Matthias, business development director at EVGroup; and Manish Ranjan, vice president of market... » read more

Preparing For Change
By Ed Sperling - 16 Aug, 2012 - Comments: 0

Throw out the most optimistic and the most pessimistic predictions about the future of the foundry model and you probably arrive at a reasonable approximation of how things will actually play out. It's clear that the number of customers at the front end of process technology will shrink after 20nm. It simply costs too much to design and manufacture a chip, and there aren’t enough markets c... » read more

Experts at the Table: Stacking the Deck
By Ed Sperling - 10 Aug, 2012 - Comments: 0

By Ann Steffora Mutschler System-Level Design sat down to discuss challenges to 3D adoption with Samta Bansal, product marketing for applied silicon realization in strategy and market development at Cadence; Carey Robertson, product marketing director at Mentor Graphics; Karthik Chandrasekar, member of technical staff in IC Design at Altera; and Herb Reiter, president of Eda2Asic Consulting. ... » read more

Preparing For 3DX
By Aveek Sarkar - 09 Aug, 2012 - Comments: 0

By Aveek Sarkar Undoubtedly we live in the age of mobility—smartphones, tablets, and ultra-books have transformed the way we work, live, and communicate. The worldwide smartphone market’s forecasted 24% CAGR, between 2010 and 2015 provides unique opportunities1. In emerging economies, more than 1 billion consumers are ready for the next new mobile platform2. Success in this market demands ... » read more

Meeting Emerging Needs For Next-Generation 3D-IC And Sub-20nm Designs
By Various Writers - 09 Aug, 2012 - Comments: 0

To remain competitive, IC designers must meet performance, power and price goals. However, these mutually conflicting goals require design techniques including 3D stacked-die architectures that will help meet performance and power targets by extending the integration capabilities beyond traditional SoC methodologies. To download this white paper, click here. » read more

Litho Community Meets And Votes
By Marc David Levenson - 31 Jul, 2012 - Comments: 0

Every 18 months or so, the leading lithography lights of the IEEE meet in an off-the-record workshop to discuss the state and future of our craft. This year’s event took place amid the restored colonial splendor of Williamsburg Virginia in June. Co-chairs Mordechai Rothschild and Lars Liebmann assembled a technical program that covered not only lithography for semiconductor manufacturing, but... » read more

Firms Rethink Fabless-Foundry Model
By Ed Sperling - 31 Jul, 2012 - Comments: 0

By Mark LaPedus As chipmakers move toward 20nm designs, finFETs and 3D stacked devices, the industry is beginning to re-think the fabless-foundry model. Leading-edge foundries are finally getting serious about the “virtual IDM” model, in which vendors will act more like integrated device manufacturers (IDMs), as opposed to being mere production partners. In this model, the found... » read more

The Changing Role Of The OSAT
By Ed Sperling - 31 Jul, 2012 - Comments: 0

By Ann Steffora Mutschler As process geometries and packaging technologies have matured over time, the OSAT (outsourced semiconductor assembly and test) provider has played an evolving role in the semiconductor packaging ecosystem. With true 3D chip stacking on the horizon, their role may evolve once again as ecosystem players jostle for position in the 3D universe. There are two things tha... » read more

Experts At The Table: Stacking The Deck
By Ed Sperling - 26 Jul, 2012 - Comments: 0

By Ann Steffora Mutschler There is no doubt 3D stacking brings challenges not only from the design perspective, but also on the tool side. EDA vendors have been working for more than a few years to ready tools for stacked-die designs. How smooth the transition is, however, is a big question mark. Because the approach is new, not all the challenges are fully understood yet. And while most ED... » read more

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