Huawei: 5G Is About Capacity, Not Speed


Paul Scanlan, CTO of the Huawei Carrier Business Group in Huawei Technologies, sat down with Semiconductor Engineering to talk about 5G, which use cases are attractive and why, and how that compares with previous wireless technologies. SE: Where are you seeing 5G, and how do you see this rolling out both for sub-6GHz and millimeter wave? Scanlan: 5G is a platform for transformation. The f... » read more

Power/Performance Bits: Aug. 18


Flexible, hole-filled films Researchers from Daegu Gyeongbuk Institute of Science and Technology (DGIST) and Hongik University propose a simple way to make flexible electrodes and thin film transistors last longer: adding lots of tiny holes. A major problem with flexible electronics is the formation of microscopic cracks after repeated bending which can cause the device to lose its conducti... » read more

From Cloud To Cloudlets


Cloudlets, or mini-clouds, are starting to roll out closer to the sources of data in an effort to reduce latency and improve overall processing performance. But as this approach gains steam, it also is creating some new challenges involving data distribution, storage and security. The growing popularity of distributed clouds is a recognition that the cloud model has limitations. Sending the ... » read more

Preparing For A Barrage Of Physical Effects


Advancements in 3D transistors and packaging continue to enable better power and performance in a given footprint, but they also require more attention to physical effects stemming from both increased density and vertical stacking. Even in planar chips developed at 3nm, it will be more difficult to build both thin and thick oxide devices, which will have an impact on everything from power to... » read more

5G Brings New Testing Challenges


As 5G nears commercial reality, makers of chips and systems that will support 5G will need to take on the standard burden of characterizing and testing their systems to ensure both performance and regulatory adherence. Millimeter-wave (mmWave) and beamforming capabilities present the biggest testing challenges. “5G is expected to have the extended coverage plus the bandwidth to harness ... » read more

Considerations For 5G Production Test


Like all technology advancements, bringing 5G to market requires an array of supporting tools to ensure the end products meet expectations. It will require significant performance advances in chip technology and manufacturing processes—all the while keeping price/performance at an economically viable level. Earlier this year, FormFactor’s Daniel Bock along with Jeff Damm outlined three c... » read more

WiFi Evolves For The IoT


WiFi is everywhere, and it’s the most prevalent of the communication protocols that use unlicensed spectrum. But as a common protocol for the Internet of Things (IoT), it faces challenges both because of congestion and the amount of energy it consumes. Two new approaches aim to address those concerns. One is to use multiple channels at once. The second involves the new 802.11ah HaLow stand... » read more

Running With O-RAN


5G standards are opening the world of hardware development to anyone that can build the best, cost-effective products. At the heart of many of those products is the system on a chip (SoC) that needs to be verified within the context of the overall system. Many new companies are in 5G chip development now, delivering custom solutions that match the many configurations need for different rural an... » read more

What’s After 5G


This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This is far from trivial. 5G only just recently entered the commercial world, and — especially with the higher millimeter-wave (mmWave) frequencies — it has ... » read more

Speeding Up The R&D Metrology Process


Several chipmakers are making some major changes in the characterization/metrology lab, adding more fab-like processes in this group to help speed up chip development times. The characterization/metrology lab, which is generally under the radar, is a group that works with the R&D organization and the fab. The characterization lab is involved in the early analytical work for next-generati... » read more

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