5G Gets Closer To Commercialization


Cellular carriers would like to have their new 5G networks up by the end of 2018 or early 2019. One problem: they need a set of standards to create the new technology. In June, tech representatives met and made significant first step for technology companies to start building out the necessary 5G chips and software. In La Jolla, California, the 3rd Generation Partnership Project (3GPP) met f... » read more

New 5G Hurdles


Semiconductor Engineering sat down to talk about challenges and progress in 5G with Yorgos Koutsoyannopoulos, president and CEO of Helic; Mike Fitton, senior director of strategic planning and business development at Achronix; Sarah Yost, senior product marketing manager at National Instruments; and Arvind Vel, director of product management at ANSYS. What follows are excerpts of that conversat... » read more

High-Speed SerDes At 7nm


eSilicon’s David Axelrad discusses the challenges with 56Gbps and 112Gps SerDes, and why the switch from analog to digital is required for performance and low power. https://youtu.be/E-CU8TLvjjc » read more

Not Enough Respect For SoC Interconnect


For high-volume system-on-chip (SoC) applications—artificial intelligence (AI), automotive, mobility, solid state drives and more—effective interconnect technology can generate hundreds of millions of dollars in revenue due to smaller chip area, better functionality and faster delivery of SoC platforms. State-of-the-art interconnect technology also allows chip designers to create SoC deriva... » read more

Week in Review: IoT, Security, Auto


Automotive Tech Marvell Technology Group opened its automotive electromagnetic compatibility lab in North America. The facility is CISPR 25-qualified and gives the chip company the capability to conduct in-house electrostatic discharge, emission, and immunity testing. Marvell also reported that its 88Q2112 offering received a mark of 100% in conformance testing outlined by the Japan Automotive... » read more

Mixed Outlook For Semi Biz


Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

Energy At The Edge


Ever since the first mention of the IoT, everyone assumed there would be billions of highly efficient battery-powered devices that drew milliwatts of energy. As it turns out, we are about to head down a rather different path. The enormous amount of data that will be gathered by sensors everywhere cannot possibly be sent to the cloud for processing. The existing infrastructure cannot handle i... » read more

Five DAC Keynotes


The ending of Moore's Law may be about to create a new golden age for design, especially one fueled by artificial intelligence and machine learning. But design will become task-, application- and domain-specific, and will require that we think about the lifecycle of the products in a different way. In the future, we also will have to design for augmentation of experience, not just automation... » read more

Week in Review: IoT, Security, Auto


Deals ArterisIP inked a deal with Mobileye, which has bought multiple licenses for ArterisIP's interconnect and resilience technology for functional safety and AI hardware acceleration. Mobileye, which was purchased by Intel last year for $15.3 billion, will use the technology for ISO 26262/ASIL B and D SoCs. Siemens agreed to operate its MindSphere digital operating system on Alibaba Cloud... » read more

Preparing For A 5G World


Semiconductor Engineering sat down to talk about challenges and progress in 5G with Yorgos Koutsoyannopoulos, president and CEO of Helic; Mike Fitton, senior director of strategic planning and business development at Achronix; Sarah Yost, senior product marketing manager at National Instruments; and Arvind Vel, director of product management at ANSYS. What follows are excerpts of that conversat... » read more

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