tag: 5G

Fan-Outs vs. TSVs
By Jeff Dorsch - 13 Dec, 2017 - Comments: 0

Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month's 3D Architectures for Heterogeneous Integration and Packaging conference in Burlingame, Cali... » read more

Power/Performance Bits: Dec. 12
By Jesse Allen - 12 Dec, 2017 - Comments: 0

Sunny days slow 5G 5G networks promise a world of fast wireless data speeds and connected everything.  However, researchers at Embry-Riddle Aeronautical University and King Saud University found that hot, sunny weather could degrade 5G cellular transmissions by more than 15%. The researchers focused on how solar radio emissions would affect the unlicensed 60 GHz bands, part of the millimet... » read more

IoT’s Many Different Forms
By Jeff Dorsch - 07 Dec, 2017 - Comments: 1

The Internet of Things is settling into widespread industrial applications, along with precision agriculture, while consumer IoT continues to find its way into the home through smart speakers and their digital assistants, such as Amazon Echo, Apple HomeKit, and Google Home. The Internet of Cows and the Internet of Tomatoes may sound like fanciful subjects, yet there is serious technology in ... » read more

5 Pitfalls That May Kill The IoT
By Frank Schirrmeister - 30 Nov, 2017 - Comments: 0

A couple of weeks ago I participated in a panel titled “The Road to a Trillion Devices” organized by Brian Fuller at Arm TechCon. His closing question was whether we will get to the projected trillion devices in twenty years. My answer was that we may even get there faster. His opening question was what the pitfalls would be to make it difficult to get to trillion devices in the next twenty... » read more

Tech Talk: Verification
By Ed Sperling - 30 Nov, 2017 - Comments: 0

Frank Schirrmeister, Cadence's senior group director for verification platforms, talks about what's changing in verification with 5G, machine learning, greater connectivity, advanced packaging, and the growing need to build security into designs. https://youtu.be/GMF8BkmdJzE » read more

Here Comes High-Res Car Radar
By Mark LaPedus - 20 Nov, 2017 - Comments: 1

A dozen or so startups are developing high-resolution radar chips that use various modulation schemes and processes, such as CMOS, FD-SOI and even metamaterials. In theory, high-resolution radar could boost the capabilities of today’s radar for cars, as well as eliminate the need for a separate LiDAR system. But the technology is still in the research stage and has yet to be proven commerc... » read more

Aeponyx: Optical Chips For Telecom
By Ed Sperling - 19 Nov, 2017 - Comments: 0

As the amount of data grows, so does interest in silicon photonics. There is no better way to move data than with light. It's faster, requires less energy, and generates less heat. The main trouble spots come in two places—packaging the light source with another chip, and the switching technology from optical to electrical and back to optical. While companies like Intel have been working o... » read more

The Week in Review: IoT
By Jeff Dorsch - 17 Nov, 2017 - Comments: 0

Investment The city of Dresden, Germany, is touting its prospects as a tech hub in the “Silicon Saxony” ecosystem, particularly for Internet of Things technology. Bosch, the German Aerospace Center, GlobalFoundries, Infineon Technologies, and other organizations are planning to invest about €4.5 billion (approximately $5.3 billion) over several years to develop processors, sensors, and 5... » read more

The 5G Design Dilemma
By Dave Pursley - 09 Nov, 2017 - Comments: 0

Nothing says low power and high performance like an emerging wireless standard that promises to increase link bandwidth, latency, and overall capacity by orders of magnitude while also reducing power. That emerging standard, of course, is 5G. With the number of devices that are projected to use 5G, it’s no surprise that 5G is a strategic initiative for many companies. This explains why des... » read more

Targeting And Tailoring eFPGAs
By Ed Sperling - 17 Oct, 2017 - Comments: 0

Robert Blake, president and CEO of Achronix, sat down with Semiconductor Engineering to discuss what's changing in the embedded FPGA world, why new levels of customization are so important, and difficulty levels for implementing embedded programmability. What follows are excerpts of that discussion. SE: There are numerous ways you can go about creating a chip these days, but many of the prot... » read more

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