tag: 7nm

Why DSA Is Cost Effective For 7nm And Below
By Yuansheng Ma - 30 Jul, 2015 - Comments: 0

The upcoming 7nm process node presents tough challenges both for printability and cost. At 7nm and below, multi-patterning is required, which makes the manufacturing process more expensive by requiring more masks. To control costs, any alternative technology that provides equivalent yields with fewer patterning steps should be explored. One promising option is to use directed self-assembly (... » read more

Fab Issues At 7nm And 5nm
By Mark LaPedus - 23 Jul, 2015 - Comments: 2

The race toward the 7nm logic node officially kicked off in July, when IBM Research, GlobalFoundries and Samsung jointly rolled out what the companies claim are the industry’s first 7nm test chips with functional transistors. They're not alone, of course. Intel and TSMC also are racing separately to develop 7nm technology. And in the R&D labs, chipmakers also are working on technologies f... » read more

Tech Talk: Wafer Plane Analysis
By Ed Sperling - 23 Jul, 2015 - Comments: 0

Leo Pang, executive vice president at D2S, talks about the problems of patterning at 40nm and below and how to deal with them more effectively using existing equipment. [youtube vid=FbRyhw2q3fE] » read more

What Will 7nm And 5nm Look Like?
By Mark LaPedus - 23 Jul, 2015 - Comments: 0

Citing an assortment of undisclosed manufacturing issues, Intel in July pushed out the introduction of its 10nm chip and process technology to the second half of 2017. This is roughly six or more months later than expected. With the delay at 10nm, [getentity id="22846" e_name="Intel"] also pushed out its process cadence from 2 to 2.5 years. Other foundries, meanwhile, are struggling to keep ... » read more

5 Technologies To Watch
By Mark LaPedus - 23 Jul, 2015 - Comments: 0

The industry is developing a dizzying array of new technologies. In fact, there are more new and innovative technologies than ever before. And the list is countless. At least from my vantage point, I have come up with my own list of the top five technologies to watch in 2015 and beyond. They are listed in alphabetical order. (See below). Obviously, there are more than just five technologi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Jul, 2015 - Comments: 0

An alliance led by IBM Research has produced the semiconductor industry’s first 7nm test chips with functioning transistors. The breakthrough, accomplished in partnership with GlobalFoundries and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering, could result in the ability to place more than 20 billion tiny switches, or transistors, on a chip. There i... » read more

Here Comes 7nm
By Ed Sperling - 09 Jul, 2015 - Comments: 0

A consortium of companies involving IBM, GlobalFoundries and Samsung has rolled out the first 7nm test chip using silicon germanium as a substrate, using EUV to pattern multiple layers. While this doesn't mean the cost equation is even close to being solved, or that more than a handful of companies will push forward to that node anytime soon using SiGe as the substrate material, it does cre... » read more

IP Integration Challenges Increase
By Ed Sperling - 08 Jul, 2015 - Comments: 0

Semiconductor Engineering sat down with Chris Rowen, CTO of [getentity id="22032" e_name="Cadence"]'s IP group; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and mixed-signal IP at [getentity ... » read more

GF Closes On IBM Chip Business Purchase
By Ann Mutschler - 01 Jul, 2015 - Comments: 0

By Ann Steffora Mutschler, Ed Sperling and Mark LaPedus GlobalFoundries completed its acquisition of IBM's Microelectronics Group today, creating a behemoth that is expected to extend well beyond the combined footprint of the existing companies. To begin with, GlobalFoundries will get two additional fabs, one of which makes RF SOI chips. But while IBM was hesitant to expand that business ... » read more

Executive Insight: Wally Rhines
By Ed Sperling - 01 Jul, 2015 - Comments: 0

Wally Rhines, chairman and CEO of Mentor Graphics, sat down with Semiconductor Engineering to talk about what's changing across a wide swath of the industry, where the new opportunities will be, when security will become a real opportunity for EDA, and why Moore's Law will die but progress will continue forever. SE: Looking back over the past year, what's changed and where are the possible r... » read more

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