Wi-Fi 7 Moves Forward, Adding Yet Another Protocol

By Karen Heyman - 17 Jul, 2023 - Comments: 1

The latest generation Wi-Fi protocol brings better speeds and data handling, but it does little to bridge various communications technologies. That, in turn, makes it more difficult and more expensive to design chips because they must integrate and support multiple wireless technologies, including different versions of the same technology. Wireless communications technologies are often victi... » read more

Securing 5G And IoT With Fuzzing

By Synopsys - 04 Aug, 2021 - Comments: 0

5G will revolutionize many industries, with up to 100 times the speed, 100 times the capacity, and one-tenth the latency compared to 4G LTE. But in addition to providing superior performance, 5G expands the attack surface of apps and IoT devices that rely on this next-gen network. In addition to known security exploits, we’re bound to see unknown, novelty attacks. Fuzz testing (or fuzzing)... » read more

The Week In Review: Design

By Jesse Allen - 08 Jun, 2018 - Comments: 0

Tools & IP Synopsys added machine learning capabilities to its Design Platform. The company highlighted benefits to the PrimeTime signoff tool, which saw 5X faster power recovery in customer designs at leading-edge geometries. Renesas is using the tool, noting a 4X power ECO speed-up. ArterisIP unveiled a standalone last level cache (LLC) for high-performance SoCs. CodaCache can be adde... » read more

What’s The Outlook For ICs?

By Mark LaPedus - 19 May, 2016 - Comments: 1

As the semiconductor industry heads into the second half of 2016, it’s time to take the pulse of the IC sector. Based on the current signs, there’s a faint pulse, if that. Simply put, the IC market has been in the doldrums in the first half of 2016. And it looks sluggish heading into the second half. It wasn’t supposed to be like this. At the beginning of this year, many predicte... » read more

A Primer For The 802.XX Physical Layer

By Ernest Worthman - 07 Oct, 2015 - Comments: 0

This is the second installment of the 802.XX for the IoE series of articles. The first one was published in the August issue and addressed the Media Access Control (MAC) layer. In this article, we will examine the elements of the physical (PHY) layer of the 802.11 protocol stack. For reference, the protocol stack is shown in figure 1. The best designs, like everything else, are built on a so... » read more

802.XX And The IoE

By Ernest Worthman - 03 Sep, 2015 - Comments: 0

Ever since the first 802.11 standard was published in 1997, it has evolved to become the de facto protocol for much of the wireless networking across a wide range of devices and implementations. Today the protocol family includes 802.b 802.11a, 802.11g, 802.11n, and 802.11ac, respectively. Some of these will play a very important role in the IoE. There are other 802.xx protocols (such as 802.15... » read more

Wireless Technologies For The IoE

By Ernest Worthman - 02 Apr, 2015 - Comments: 0

It's generally understood the [getkc id="76" kc_name="Internet of Everything"] eventually will be the interconnect platform of all things, wireless and wireline. The utopian scenario is to have a common platform, with standardized protocols, which everyone builds to. Will that happen? Perhaps, but for a time, especially while the IoE evolves, that won’t be the case. Count on the early IoE bei... » read more

How To Test IoT Devices

By Mark LaPedus - 11 Dec, 2014 - Comments: 0

At a recent event, test experts said the IC industry needs a new paradigm in testing chips for the [getkc id="76" comment="Internet of Things"] (IoT). The message was fairly simple to interpret. Existing automatic test equipment (ATE) is well suited to test today’s digital, analog, and mixed-signal chips, though it may be ill-equipped or too expensive to test IoT-based devices. But wha... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: 802.11