tag: AMD

What’s New At Hot Chips
By Jeff Dorsch - 25 Aug, 2017 - Comments: 0

By Jeff Dorsch & Ed Sperling Machine learning, artificial intelligence and neuromorphic computing took center stage at Hot Chips 2017 this week, a significant change from years past where the focus was on architectures that addressed improvements in speed and performance for standard compute problems. What is clear, given the focus of presentations, is that the bleeding edge of comput... » read more

Portable Stimulus Status Report
By Brian Bailey - 24 Aug, 2017 - Comments: 0

The first release of the Portable Stimulus (PS) standard is slated for early next year. If it lives up to its promise, it could be the first new language and abstraction for verification in two decades. [getentity id="22028" e_name="Accellera"] uncorked the PS Early Adopter release at the Design Automation Conference (DAC) in June. The standard has been more than two years in the making by t... » read more

Modeling Of The Electrical Performance Of The Power And Ground Supply For A PC Microprocessor On A Card
By Cadence - 09 Aug, 2017 - Comments: 0

The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis. The effects of decoupling capacitors of different types and at different locations are investigated to achieve the objectives of low power and ground impedance and no or insignificant resonances ... » read more

The Secret Life Of Accelerators
By Ed Sperling - 27 Jul, 2017 - Comments: 0

Accelerator chips increasingly are providing the performance boost that device scaling once provided, changing basic assumptions about how data moves within an electronic system and where it should be processed. To the outside world, little appears to have changed. But beneath the glossy exterior, and almost always hidden from view, accelerator chips are becoming an integral part of most des... » read more

Start Your HBM/2.5D Design Today
By eSilicon - 28 Jun, 2017 - Comments: 0

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology. In June 2015, AMD introduced its Fiji processor, the first HBM 2.5D design, which comp... » read more

Architecture First, Node Second
By Ed Sperling - 15 Jun, 2017 - Comments: 0

What a difference a node makes. A couple of rather important changes have occurred in the move from 16/14 to 10/7nm (aside from more confusing naming conventions). First, companies that require more transistors—processor companies such as [getentity id="22846" e_name="Intel"], AMD, [getentity id="22306" comment="IBM"] and [getentity id="22676" e_name="Qualcomm"]—have come to grips with t... » read more

Advanced Packaging Goes Mainstream
By Ed Sperling - 08 May, 2017 - Comments: 0

The roadmap for shrinking digital logic will continue for at least the next 10 years. For others devices, particularly analog, it will slow down or end. And therein lies one of the most fundamental changes in semiconductor design and manufacturing in the past half century. This is no longer just talk. Apple is using a fan-out architecture in its iPhone 7. Memory makers are stacking NAND and ... » read more

Can Formal Replace Simulation?
By Brian Bailey - 01 May, 2017 - Comments: 1

A year ago, [getentity id="22147" comment="Oski Technology"] achieved something that had never happened before. It brought together 15 of the top minds in [getkc id="33" kc_name="formal verification"] deployment and sat them down in a room to discuss the problems and issues they face and the ways in which they are attempting to solve those problems. Semiconductor Engineering was there to record... » read more

Time For Massively Parallel Testing
By Jeff Dorsch - 12 Apr, 2017 - Comments: 0

Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

The Week In Review: Design
By Jesse Allen - 10 Mar, 2017 - Comments: 0

SoftBank plans to sell a 25% stake in ARM to Vision Fund, a $100 billion technology fund created last year by SoftBank and Saudi Arabia's Public Investment Fund. SoftBank and Saudi Arabia are investing $25 billion and $45 billion in the fund, respectively. Another potential major player is Mubadala Development Co., the government-owned Abu Dhabi investment firm which owns GlobalFoundries and, a... » read more

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