Micron D1α, The Most Advanced Node Yet On DRAM

By Jeongdong Choe - 22 Jul, 2021 - Comments: 0

Finally, we got to see D1α DRAM generation! It’s 14nm! After a quick viewing of the Micron D1α die (die markings: Z41C) and its cell design, we have determined its actual technology node (design rule), in contrast to the claims of market literature. It is the most advanced technology node ever on DRAM, and it is the first sub-15nm cell integrated DRAM product. The Micron Z41C die removed... » read more

PF-DRAM: A Precharge-Free DRAM Structure

By Technical Paper Link - 02 Jul, 2021 - Comments: 0

Authors: Nezam Rohbani † (IPM); Sina Darabii § (Sharif); Hamid Sarbazi-Azad † i §(Sharif / IPM): † School of Computer Science, Institute for Research in Fundamental Sciences (IPM), Tehran, Iran § Department of Computer Engineering, Sharif University of Technology, Tehran, Iran Abstract: "Although DRAM capacity and bandwidth have increased sharply by the advances in technology ... » read more

Accelerating AI/ML Inferencing With GDDR6 DRAM

By Frank Ferro - 10 Jun, 2021 - Comments: 0

The origins of graphics double data rate (GDDR) memory can be traced to the rise of 3D gaming on PCs and consoles. The first graphics processing units (GPU) packed single data rate (SDR) and double data rate (DDR) DRAM – the same solution used for CPU main memory. As gaming evolved, the demand for higher frame rates at ever higher resolutions drove the need for a graphics-workload specific me... » read more

Is There a Practical Test For Rowhammer Vulnerability?

By Bryon Moyer - 08 Jun, 2021 - Comments: 3

Rowhammer is proving to be a difficult DRAM issue to fix. While efforts continue to mitigate or eliminate the effect, no solid solution has yet made it to volume production. In addition, more aggressive process nodes are expected to exacerbate the problem. In the absence of a fix, then, testing may be one way to give DRAM manufacturers and users some way to segregate devices that are more su... » read more

Demand, Lead Times Soar For 300mm Equipment

By Mark LaPedus - 20 May, 2021 - Comments: 0

A surge in demand for various chips is causing select shortages and extended lead times for many types of 300mm semiconductor equipment, photomask tools, wafers, and other products. For the last several years, 200mm equipment has been in short supply in the market, but issues are now cropping up throughout the 300mm supply chain, as well. Traditionally, lead times have been three to six mont... » read more

Advanced Packaging’s Next Wave

By Mark LaPedus - 20 May, 2021 - Comments: 0

Packaging houses are readying the next wave of advanced packages, enabling new system-level chip designs for a range of applications. These advanced packages involve a range of technologies, such as 2.5D/3D, chiplets, fan-out and system-in-package (SiP). Each of these, in turn, offers an array of options for assembling and integrating complex dies in an advanced package, providing chip custo... » read more

HBM Takes On A Much Bigger Role

By Brian Bailey - 13 May, 2021 - Comments: 1

High-bandwidth memory is getting faster and showing up in more designs, but this stacked DRAM technology may play a much bigger role as a gateway for both chiplet-based SoCs and true 3D designs. HBM increasingly is being viewed as a way of pushing heterogenous distributed processing to a completely different level. Once viewed as an expensive technology that only could be utilized in the hig... » read more

Latest IC Forecast: Big Demand, Shortages

By Mark LaPedus - 15 Apr, 2021 - Comments: 1

Over the last year, the semiconductor industry has seen its share of highs, lows and uncertainties. In early 2020, the business looked bright, but the IC market dropped amid the Covid-19 pandemic outbreak. Throughout 2020 different countries implemented a number of measures to mitigate the outbreak, such as stay-at-home orders and business closures. Economic turmoil and job losses soon follo... » read more

New Uses For AI

By Ed Sperling - 01 Apr, 2021 - Comments: 0

AI is being embedded into an increasing number of technologies that are commonly found inside most chips, and initial results show dramatic improvements in both power and performance. Unlike high-profile AI implementations, such as self-driving cars or natural language processing, much of this work flies well under the radar for most people. It generally takes the path of least disruption, b... » read more

Computing Where Data Resides

By Ann Mutschler - 29 Mar, 2021 - Comments: 3

Computational storage is starting to gain traction as system architects come to grips with the rising performance, energy and latency impacts of moving large amounts of data between processors and hierarchical memory and storage. According to IDC, the global datasphere will grow from 45 zettabytes in 2019 to 175 by 2025. But that data is essentially useless unless it is analyzed or some amou... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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