Falling Chip Forecasts

By Mark LaPedus - 20 Jun, 2019 - Comments: 1

It’s time to take a pulse of the semiconductor market amid the memory downturn and trade frictions with China. For some time, the DRAM and NAND markets have been hit hard with falling prices and oversupply. Then, the Trump administration last year slapped tariffs on Chinese goods. China retaliated. And the trade war rages on between the U.S. and China. More recently, the U.S. Department... » read more

What’s Next In Advanced Packaging

By Mark LaPedus - 20 Jun, 2019 - Comments: 3

Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, Leti/STMicroelectronics, TSMC and others described some of their new and advanced IC packaging technologies, which involve various product categories, such as 2.5D, 3D and fan-out. Some new packaging technologies ar... » read more

Playing Into China’s Hands

By Ed Sperling - 13 Jun, 2019 - Comments: 1

The fallout over blacklisting Huawei in particular, and China in general, has set the tone for a nasty global race. But it is almost certain to produce a different result than the proponents of a trade war are expecting. The idea behind tariffs and the blacklisting of Huawei is to starve China of vital technology. So far, the impact has been minimal. Reports from inside of China are equa... » read more

HBM2e Offers Solid Path For AI Accelerators

By Sanjay Charagulla - 13 Jun, 2019 - Comments: 0

Today, AI processors are so blazingly fast that they’re constantly having to wait for data from memory. Unfortunately, with the status quo, memory is just not fast enough to unleash the true performance of those new and highly advancing AI processors. In simple terms, AI processor performance is rapidly growing, and memory is not keeping up. This creates a bottleneck, or what Rambus calls the... » read more

Memory Options And Tradeoffs

By Ed Sperling - 13 Jun, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, talks with Semiconductor Engineering about different memory options, why some are better than others for certain tasks, and what the tradeoffs are between the different memory types and architectures. Related Articles/Videos Memory Tradeoffs Intensify In AI, Automotive Applications Why choosing memories and archi... » read more

HBM2 Vs. GDDR6: Tradeoffs In DRAM

By Ed Sperling - 13 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to talk about new DRAM options and considerations with Frank Ferro, senior director of product management at Rambus; Marc Greenberg, group director for product marketing at Cadence; Graham Allan, senior product marketing manager for DDR PHYs at Synopsys; and Tien Shiah, senior manager for memory marketing at Samsung Electronics. What follows are excerpts of th... » read more

Clean Focus, Dose And CD Metrology For CD Uniformity Improvement

By KLA - 11 Jun, 2019 - Comments: 0

Authors: Honggoo Leea, Sangjun Hana, Minhyung Honga, Seungyong Kima, Jieun Leea, DongYoung Leea, Eungryong Oha, Ahlin Choia, Nakyoon Kimb, John C. Robinsonc, Markus Mengelc, Pablo Rovirac, Sungchul Yooc, Raphael Getinc, Dongsub Choib, Sanghuck Jeonb aSK Hynix, 2091, Gyeongchung-daero, Bubal-eub, Icheon-si, Gyeonggi-do, 467-701, Korea bKLA-Tencor Korea, Starplaza bldg., 53 Metapolis-ro, Hwasung... » read more

Chiplet Momentum Builds, Despite Tradeoffs

By Brian Bailey - 13 May, 2019 - Comments: 0

Chip design is a series of tradeoffs. Some are technical, others are related to cost, competitive features or legal restrictions. But with the nascent 'chiplet' market, many of the established balance points are significantly altered, depending on market segments and ecosystem readiness. Chiplets provide an alternative mechanism for integrating intellectual property (IP) blocks into a semico... » read more

Latency Under Load: HBM2 vs. GDDR6

By Ed Sperling - 09 May, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, explains why data traffic and bandwidth are critical to choosing the type of DRAM, options for improving traffic flow in different memory types, and how this works with multiple memory types. Related Video GDDR6 - HBM2 Tradeoffs Why designers choose one memory type over another. Applications for each were clearly delineate... » read more

Improving Edge Inferencing

By Ed Sperling - 02 May, 2019 - Comments: 0

Cheng Wang, senior vice president of engineering at Flex Logix, talks with Semiconductor Engineering about how to improve the efficiency and speed of edge inferencing chips, what causes bottlenecks, and why AI chips are different from other types of semiconductors. » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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