Designing In The Cloud

By Ranjit Adhikary - 06 Jun, 2019 - Comments: 0

Amazon AWS was launched back in 2006. Web based services such as Netflix and Expedia were early adopters, and AWS has grown rapidly, bringing in competition from Google (GCP), Microsoft (Azure) and others. It has taken a while for the design community to embrace the ‘cloud’ as some of the needs and concerns of design teams are different. Cloud vendors have recognized this untapped market ... » read more

DAC 2019: Day 3

By Brian Bailey - 06 Jun, 2019 - Comments: 0

Two keynotes get day three of DAC started. The first by John Cohn, Massachusetts Institute of Technology & IBM Watson AI Lab. "I am a nerd. Look back 100 years in processing. We have gone from mechanical computing to where we are today, but it has not been a smooth curve. There are smooth places and then discontinuities. This is when what you were working on no longer works. How we make tho... » read more

DAC 2019: Day 2

By Brian Bailey - 05 Jun, 2019 - Comments: 0

Day two of DAC started off with a highly anticipated keynote given by Thomas Dolby, musician, producer and innovator. Dolby has always been fascinated with the convergence of music and technology. He started off with a fanfare by balancing a broom on his finger to demonstrate the type of control we have as human beings. He went on to expand the analogy to the hive mind of groups of individuals,... » read more

Training Tomorrow’s Chip Designers

By Ann Mutschler - 05 Jun, 2019 - Comments: 1

With technology advancing rapidly and the growing number of open R&D projects, there is an expanding need for qualified engineers. To make this possible, practical education needs to start much earlier than after graduation. One the best ways the EDA and semiconductor industry has embraced is encouraging engineering students to cooperate with experienced engineers, technologists and indu... » read more

ATE Lab To Fab

By Ed Sperling - 05 Jun, 2019 - Comments: 2

Shu Li, business development manager at Advantest, zeroes in on the communication gap between engineers on the design side and the manufacturing/test side, why it exists, and what needs to be done to bridge that gap in order to speed up and improve test quality. https://youtu.be/Nd-5_twbJBw See other tech talk videos here » read more

DAC 2019: Day 1

By Brian Bailey - 04 Jun, 2019 - Comments: 2

The last time that DAC was in Las Vegas was 2001. Much has changed since then. The first day kicked off with the usual ceremonies and then two short keynotes. A change from previous years is that keynotes are now on the show floor. This is presumably to ensure that once the keynotes are over, everyone sees the vendor booths. During the commencement session, it was also announced that all cof... » read more

CEO Outlook: It Gets Much Harder From Here

By Ed Sperling - 03 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss what's changing across the semiconductor industry with Wally Rhines, CEO emeritus at Mentor, a Siemens Business; Jack Harding, president and CEO of eSilicon; John Kibarian, president and CEO of PDF Solutions; and John Chong, vice president of product and business development for Kionix. What follows are excerpts of that discussion, which was held in... » read more

Moore Open Source Coming

By Brian Bailey - 30 May, 2019 - Comments: 0

The sunsetting of Moore's Law is creating some interesting ripples throughout the EDA and IP industries. No longer is the low-risk path defined by a migration to the next node. Most companies cannot afford it and don’t need it. Neither can their competitors. Suddenly, they have to do more with less, or at least the same amount. Consider just a few things that are changing today: Stick... » read more

Extending RISC-V ISA With Custom Instruction Set Extension

By Codasip - 29 May, 2019 - Comments: 0

RISC-V ISA (Instruction Set Architecture) is designed in a modular way. It means that the ISA has several groups of instructions (ISA extensions) that can be enabled or disabled as needed. This allows implementing precisely the instruction groups that the application needs, without having to pay for area or power that will not be used. One of the groups is special; it has no predefined instruct... » read more

The Changing Landscape of Hardware-Based Verification And Software Development

By Frank Schirrmeister - 24 May, 2019 - Comments: 0

As the EDA is gearing up for its biggest industry event, the Design Automation Conference (DAC), this year in Las Vegas, it is interesting to observe what is going on in hardware-based development of emulation and prototyping. The trends I had outlined after last DAC in 2018—system design, cloud, and machine learning—have only grown stronger and are causing changes in the development landsc... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.