tag: IBM

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
By Technical Paper Link - 31 Mar, 2021 - Comments: 0

Abstract: "Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to gui... » read more

Manufacturing Bits: March 30
By Mark LaPedus - 30 Mar, 2021 - Comments: 0

Open access quantum computing Sandia National Laboratories has begun offering an open access program for its quantum computing testbed. Sandia will enable researchers to explore a range of new technologies, such as chemistry, materials science and mathematics, using its so-called Quantum Scientific Computing Open User Testbed (QSCOUT). Quantum computers promise to solve problems that are to... » read more

EUV Pellicles Finally Ready
By Mark LaPedus - 22 Mar, 2021 - Comments: 0

After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Mar, 2021 - Comments: 0

Chipmakers and OEMs Micron will cease development of 3D XPoint, a next-generation memory technology. Micron also plans to sell a fab that produces 3D XPoint chips. For some time, Intel and Micron have co-developed 3D XPoint, which is based on phase-change memory technology. Intel sells solid-state storage drives (SSDs) using 3D XPoint. In a fab located in Utah, Micron is producing this memo... » read more

Chasing After Carbon Nanotube FETs
By Mark LaPedus - 18 Mar, 2021 - Comments: 6

Carbon nanotube transistors are finally making progress for potential use in advanced logic chips after nearly a quarter century in R&D. The question now is whether they will move out of the lab and into the fab. Several government agencies, companies, foundries, and universities over the years have been developing, and are now making advancements with carbon nanotube field-effect transi... » read more

MRAM Evolves In Multiple Directions
By Bryon Moyer - 11 Mar, 2021 - Comments: 1

Magnetoresistive RAM (MRAM) is one of several new non-volatile memory technologies targeting broad commercial availability, but designing MRAM into chips and systems isn't as simple as adding other types of memory. MRAM isn’t an all-things-for-all-applications technology. It needs to be tuned for its intended purpose. MRAMs targeting flash will not do as well targeting SRAMs, and vice vers... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Mar, 2021 - Comments: 0

Tools Synopsys introduced Euclide, a next-generation hardware description language (HDL)-aware integrated development environment (IDE). Euclide aims to enable earlier detection of bugs and optimize code for design and verification flows by identifying complex design and testbench compliance checks during SystemVerilog and UVM development. It assists correct-by-construction code development th... » read more

Brazil Paves New Semiconductor Path
By Mark LaPedus - 22 Feb, 2021 - Comments: 3

After struggling to get its semiconductor industry off the ground for the last several years, Brazil finally may have found its place in the market with the development of IC design services, memory modules and packaging. Brazil exists well under the radar when it comes to semiconductors. But with little or no fanfare, the nation over the years has been trying to build fabs, assemble chips a... » read more

Breaking The 2nm Barrier
By Mark LaPedus - 18 Feb, 2021 - Comments: 4

Chipmakers continue to make advancements with transistor technologies at the latest process nodes, but the interconnects within these structures are struggling to keep pace. The chip industry is working on several technologies to solve the interconnect bottleneck, but many of those solutions are still in R&D and may not appear for some time — possibly not until 2nm, which is expected t... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 12 Feb, 2021 - Comments: 0

Automotive/Mobility With the chip supply so tight it is shutting down automotive production lines, U.S. chip company CEOs signed a Semiconductor Industry Association (SIA) letter asking the U.S. president to include funding incentives for the chip manufacturing in U.S. economic recovery plans. The letter references the CHIPS for America Act and asks the president to work with Congress to suppo... » read more

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