tag: IBM

5 Issues Under The Foundry Radar
By Mark LaPedus - 16 Apr, 2015 - Comments: 0

In the foundry business, the leading-edge segment grabs most, if not all, of the headlines. Foundry vendors, of course, are ramping up 16nm/14nm finFET processes, with 10nm and 7nm in R&D. The leading-edge foundry business is sizable, but it’s not the only thing going on in the competitive arena. In fact, there are battles taking place in many other foundry segments, such as 2.5D/3D packag... » read more

Stacked Die, Phase Two
By Ed Sperling - 09 Apr, 2015 - Comments: 0

The initial hype phase of [getkc id="82" kc_name="2.5D"] appears to be over. There are multiple offerings in development or on the market already from Xilinx, Altera, Cisco, Huawei, IBM, AMD, all focused on better throughput over shorter distances with better yield and lower power. Even Intel has jumped on the bandwagon, saying that 2.5D will be essential for extending [getkc id="74" comment="M... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Mar, 2015 - Comments: 0

Intel is in talks to buy Altera, according to The Wall Street Journal. If a deal is reached, Intel would enter the FPGA market amid a slowdown in its core processors business. Intel would also secure its largest foundry customer in Altera. For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above wor... » read more

The Week In Review: Design/IoT
By Jesse Allen - 27 Mar, 2015 - Comments: 0

Tools Mentor Graphics uncorked its new IC, package, and PCB co-design and optimization product. It includes a formal flow for ball grid array ball-map planning and optimization based on an "intelligent pin" concept and a multi-mode connectivity management system for cross-domain pin-mapping and system level cross-domain logical verification. Synopsys released a new tool for designing ASIP... » read more

5 Reasons EUV Will Or Won’t Be Used
By Michael Watts - 19 Mar, 2015 - Comments: 1

Digging into this subject, there are five metrics that count in a lithography tool: resolution, throughput, defects, overlay, and reliability. So what does the best data tell us about the current state and realistic prognosis for [gettech id="31045" comment="EUV"]. Semiconductor Engineering posed this question to Matt Colburn, senior manager for patterning research at [getentity id="22306" comm... » read more

Rethinking The Cloud
By Ed Sperling - 12 Mar, 2015 - Comments: 0

Data center architectures have seen very few radical changes since the commercial introduction of the [getentity id="22306" comment="IBM"] System/360 mainframe in 1964. There have been incremental improvements in speed and throughput over the years, with a move to a client/server model in the 1990s, but from a high level this is still an environment where data is processed and stored centrally ... » read more

NXP To Buy Freescale For $16.7B
By Ann Mutschler - 02 Mar, 2015 - Comments: 0

By Ann Steffora Mutschler & Ed Sperling Dutch semiconductor giant NXP Semiconductors will buy Texas-based Freescale Semiconductor for $16.7 billion—$11.8 billion in cash, $5.6 billion worth of debts, minus $696 million in cash reserves—creating a combined company with a broad-based product portfolio and projected annual revenue of more than $10 billion. Given the size of the deal... » read more

How To Deal With Electromigration
By Katherine Derbyshire - 02 Mar, 2015 - Comments: 8

The replacement of aluminum with copper interconnect wiring, first demonstrated by IBM in 1997, brought the integrated circuit industry substantial improvements in both resistance to electromigration and line conductivity. Copper is both a better and more stable conductor than aluminum. Difficult though the transition was, it helped extend device scaling for another eighteen years (and counting... » read more

The Week In Review: Design/IoT
By Jesse Allen - 27 Feb, 2015 - Comments: 0

Mergers & Acquisitions NXP acquired Quintic’s Bluetooth Low Energy and Wearable businesses, adding BLTE to their low power RF-connectivity portfolio. The team of approximately 65 is expected to join NXP when the deal closes in Q1 2015. Tools Cadence unveiled the integration of Forte's Cynthesizer with their own C-to-Silicon Compiler. The result is the Stratus high-level synthesis... » read more

GaN Manufacturing Meets Big Silicon
By Michael Watts - 20 Feb, 2015 - Comments: 0

I have been talking about GaN on Silicon for several years because it offers a path to cost reduction in LED’s in the same way as silicon semiconductors. This year at Photonics West 2015, Aixtron presented its next generation 6-inch wafer system with all the automation that the semiconductor guys expect to be able to build GaN power transistors. The systems are configured as cluster tools... » read more

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