tag: IP

A Breakthrough In Silicon Bring-Up
By Matthew Knowles - 12 Nov, 2019 - Comments: 1

The current semiconductor market is seeing increasingly complex silicon devices for applications like 5G wireless communications, autonomous driving, and artificial intelligence. One of the ways designers are working to control design time and cost is through the adoption of IJTAG (IEEE 1687) for a plug-and-play style IP integration during design. The benefits of using IJTAG are still emerging,... » read more

Leveraging Data In Chipmaking
By Ed Sperling - 12 Nov, 2019 - Comments: 0

John Kibarian, president and CEO of PDF Solutions, sat down with Semiconductor Engineering to talk about the impact of data analytics on everything from yield and reliability to the inner structure of organizations, how the cloud and edge will work together, and where the big threats are in the future. SE: When did you recognize that data would be so critical to hardware design and manufact... » read more

Traceability Of Functional Safety Requirements In Automotive IP And SoCs
By Shivakumar Chonnad - 07 Nov, 2019 - Comments: 0

By Shivakumar Chonnad, Vladimir Litovtchenko, and Rohit Bhardwaj Developing functional safety systems, including all the components such as the system-on-chip (SoC) and IP, hinges on the ability to meet the stringent automotive functional safety requirements such as definition, implementation, verification, and validation. Depending on the Automotive Safety Integrity Level (ASIL), the functi... » read more

Service Revenue Growing With Chip Complexity
By Ann Mutschler - 04 Nov, 2019 - Comments: 0

Rising complexity, new markets, and a shortage of in-house expertise are beginning to rekindle demand for services for the first time in nearly a decade. The semiconductor industry has been racing to design chips for a variety of new and existing applications, but they are facing challenges on a number of fronts: Leading-edge chips require new architectures due to a sharp reduction in s... » read more

Migrating 3D Into The Mainstream
By Brian Bailey - 31 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

Less Food, More Thought
By Ed Sperling - 10 Oct, 2019 - Comments: 0

A trillion "things" are expected to be connected to the Internet sometime in the next decade. No matter how power-efficient these things are, they probably will require enough coin-sized lithium batteries to drain the world's supply of element No. 3 on the Periodic Table. They also will increase the demand for power everywhere, and that's even before tacking on electric vehicles, the edge, robo... » read more

More Data, More Processing, More Chips
By Ed Sperling - 07 Oct, 2019 - Comments: 0

Simon Segars, CEO of Arm, sat down with Semiconductor Engineering to talk about the impact of heterogeneous computing and new packaging approaches on IP, the need for more security, and how 5G and the edge will impact compute architectures and the chip industry. SE: There are a whole bunch of new markets opening up. How does Arm plan to tackle those? Segars: Luckily for us, we can design ... » read more

ML, Edge Drive IP To Outperform Broader Chip Market
By Kevin Fogarty - 03 Oct, 2019 - Comments: 0

The market for third-party semiconductor IP is surging, spurred by the need for more specific capabilities across a wide variety of markets. While the IP industry is not immune to steep market declines in semiconductor industry, it does have more built-in resilience than other parts of the industry. Case in point: The top 15 semiconductor suppliers were hit with an 18% decline in 2019 first-... » read more

Open ISAs Gaining Traction
By Ann Mutschler - 26 Sep, 2019 - Comments: 0

Open instruction set architectures are starting to gain a foothold, often in combination with other processors, as chipmakers begin to add more specialized compute elements and more flexibility into their designs. There are a number of these open ISAs available today, including Power, MIPS, and RISC-V, and there are a number of permutations and tools available for sale based on those archite... » read more

Why Data Is So Difficult To Protect In AI Chips
By Ed Sperling - 25 Sep, 2019 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss a wide range of hardware security issues and possible solutions with Norman Chang, chief technologist for the Semiconductor Business Unit at ANSYS; Helena Handschuh, fellow at Rambus, and Mike Borza, principal security technologist at Synopsys. What follows are excerpts of that conversation. The first part of this discussion ca... » read more

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