Migrating 3D Into The Mainstream

By Brian Bailey - 31 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

Less Food, More Thought

By Ed Sperling - 10 Oct, 2019 - Comments: 0

A trillion "things" are expected to be connected to the Internet sometime in the next decade. No matter how power-efficient these things are, they probably will require enough coin-sized lithium batteries to drain the world's supply of element No. 3 on the Periodic Table. They also will increase the demand for power everywhere, and that's even before tacking on electric vehicles, the edge, robo... » read more

More Data, More Processing, More Chips

By Ed Sperling - 07 Oct, 2019 - Comments: 0

Simon Segars, CEO of Arm, sat down with Semiconductor Engineering to talk about the impact of heterogeneous computing and new packaging approaches on IP, the need for more security, and how 5G and the edge will impact compute architectures and the chip industry. SE: There are a whole bunch of new markets opening up. How does Arm plan to tackle those? Segars: Luckily for us, we can design ... » read more

ML, Edge Drive IP To Outperform Broader Chip Market

By Kevin Fogarty - 03 Oct, 2019 - Comments: 0

The market for third-party semiconductor IP is surging, spurred by the need for more specific capabilities across a wide variety of markets. While the IP industry is not immune to steep market declines in semiconductor industry, it does have more built-in resilience than other parts of the industry. Case in point: The top 15 semiconductor suppliers were hit with an 18% decline in 2019 first-... » read more

Open ISAs Gaining Traction

By Ann Mutschler - 26 Sep, 2019 - Comments: 0

Open instruction set architectures are starting to gain a foothold, often in combination with other processors, as chipmakers begin to add more specialized compute elements and more flexibility into their designs. There are a number of these open ISAs available today, including Power, MIPS, and RISC-V, and there are a number of permutations and tools available for sale based on those archite... » read more

Why Data Is So Difficult To Protect In AI Chips

By Ed Sperling - 25 Sep, 2019 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss a wide range of hardware security issues and possible solutions with Norman Chang, chief technologist for the Semiconductor Business Unit at ANSYS; Helena Handschuh, fellow at Rambus, and Mike Borza, principal security technologist at Synopsys. What follows are excerpts of that conversation. The first part of this discussion ca... » read more

EDA Revenue Up 6.6% For Q2

By Ann Mutschler - 17 Sep, 2019 - Comments: 0

Highlighted by double digit growth in semiconductor IP and the Asia/Pacific region, EDA industry revenue increased 6.6% for Q2 2019 to $2,472.1 million, compared to $2,318.5 million in Q2 2018, according to the ESD Alliance Market Statistics Service. The four-quarters moving average, which compares the most recent four quarters to the prior four quarters, increased by 6%, which represented a... » read more

Machine Learning Inferencing At The Edge

By Ed Sperling - 12 Sep, 2019 - Comments: 1

Ian Bratt, fellow in Arm's machine learning group, talks about why machine learning inferencing at the edge is so difficult, what are the tradeoffs, how to optimize data movement, how to accelerate that movement, and how it differs from developing other types of processors. » read more

The Race For Better Computational Software

By Ed Sperling - 05 Sep, 2019 - Comments: 0

Anirudh Devgan, president of Cadence, sat down with Semiconductor Engineering to talk about computational software, why it's so critical at the edge and in AI systems, and where the big changes are across the semiconductor industry. What follows are excerpts of that conversation. SE: There is no consistent approach to how data will be processed at the edge, in part because there is no consis... » read more

IP Security In FPGAs

By Ed Sperling - 05 Sep, 2019 - Comments: 0

Quinn Jacobson, strategic architect at Achronix, talks about security in FPGAs, including how to prevent reverse engineering of IP, how to make sure the design is authentic, and how to limit access to IP in transit and in the chip. » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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