tag: IP

5nm Design Progress
By Ann Mutschler - 17 Jul, 2018 - Comments: 1

Activity surrounding the 5nm manufacturing process node is quickly ramping, creating a better picture of the myriad and increasingly complex design issues that must be overcome. Progress at each new node after 28nm has required an increasingly tight partnership between the foundries, which are developing new processes and rule decks, along with EDA and IP vendors, which are adding tools, met... » read more

Enabling Integrated ADAS Domain Controllers With Automotive IP
By Ron DiGiuseppe - 17 Jul, 2018 - Comments: 0

Traditionally, the electronic control units (ECUs) for individual Advanced Driver Assistance System (ADAS) applications have been placed throughout the car. The latest automotive architecture will integrate ECUs for multiple ADAS applications into centralized domains to combine multiple ADAS functions. The new class of integrated domain controller ECUs utilize data transferred from the car’s ... » read more

Verification As A Flow (Part 2)
By Brian Bailey - 11 Jul, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss the transformation of verification from a tool to a flow with Vladislav Palfy, global manager application engineering for OneSpin Solutions; Dave Kelf, chief marketing officer for Breker Verification Systems; Mark Olen, product marketing group manager for Mentor, A Siemens Business; Larry Melling, product management director, System & Verificati... » read more

Security Gap Grows
By Ed Sperling - 09 Jul, 2018 - Comments: 1

There is far more talk about security in designs these days, and far more security features being added into chips and systems. So why isn't it making a dent in the number of cyberattacks? According to the Online Trust Alliance, there were 159,700 cyber incidents in 2017 around the globe. But the group notes that because most incidents are not reported, the real number could be twice as lar... » read more

The Darker Side Of Consolidation
By Ed Sperling - 02 Jul, 2018 - Comments: 1

Another wave of consolidation is underway in the semiconductor industry, setting the stage for some high-stakes competitive battles over market turf and sowing confusion across the supply chain about continued support throughout a product's projected lifetime. The consolidation comes as chipmakers already are grappling with rising complexity, the loss of a roadmap for future designs as Moore... » read more

The Skies Over EDA Are Finally Cloudy
By Tom Anderson - 28 Jun, 2018 - Comments: 0

EDA companies have been talking for years about providing access to their tools in the cloud, including more articles than I can count with titles about the EDA forecast being cloudy, clouds on the horizon, and so forth. The title of this post continues the dubious tradition of cloud-based puns, but there’s no future tense involved. Recent announcements from several EDA companies make it appe... » read more

Blog Review: June 27
By Jesse Allen - 27 Jun, 2018 - Comments: 0

Applied Materials' Sundeep Bajikar argues that to realize the full potential of AI, new computing architectures are necessary, otherwise AI will quickly become unaffordable. Synopsys' Iain Singleton considers why it may not always be necessary to start at the reset state during formal verification and how to use abstractions to get a head start on bug hunting. Cadence's Meera Collier look... » read more

It Takes A Village To Get A Design Done
By Ciarán Dunne - 18 Jun, 2018 - Comments: 0

No one lacks for brilliant ideas these days. In fact, it’s a golden age of innovation. But where the pace of innovation can slow is getting that idea to market. Take for example, the case of one of S3 Semiconductors' customers.. It recently developed a custom chip solution for a company in the oil and gas industry that was creating complex valve controllers that sensed pressure and tempera... » read more

IoT Wireless Battles Ahead
By Brian Bailey - 18 Jun, 2018 - Comments: 0

"The good thing about standards is that there are so many to choose from." – Andrew S. Tanebaum The extended version of that quote adds "furthermore, if you do not like any of them, you can just wait for next year's model." That could not be truer when it comes to IoT and wireless connectivity. Every standards group is rushing to create new versions of existing standards that use less p... » read more

Chip Dis-Integration
By Brian Bailey - 14 Jun, 2018 - Comments: 2

Just because something can be done does not always mean that it should be done. One segment of the semiconductor industry is learning the hard way that continued chip integration has a significant downside. At the same time, another another group has just started to see the benefits of consolidating functionality onto a single substrate. Companies that have been following Moore's Law and hav... » read more

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