Tools For Heterogeneous System Development


System architects look to both heterogeneous and homogeneous computing when there are no other options available, but the current thinking is that a system-level software methodology could simplify the design, ease integration of various blocks, and potentially improve performance for less power. While the theory appears sound enough, implementing it has turned out to be harder than expected. ... » read more

Formal’s Roadmap


Formal verification has come a long way in the past five years as it focused on narrow tasks within the verification flow. Semiconductor Engineering sat down to discuss that progress, and the future of formal technologies, with [getperson id="11306" comment="Raik Brinkmann"], president and CEO of [getentity id="22395" e_name="OneSpin Solutions"]; Harry Foster, chief verification scientist at [g... » read more

IP Liability Changes Ahead?


Patent lawyers are keeping close tabs on a biotech patent infringement case that went before the Supreme Court this week because it could have a significant impact on IP content in other markets, including semiconductors. On Tuesday, attorneys for Life Technologies Corp. and Promega Corp., presented arguments before the U.S. Supreme Court involving an enzyme for amplifying DNA analysis. For ... » read more

How High-Level Synthesis Was Used to Develop An Image-Processing IP Design From C++ Source Code


Imagine working long and hard on a design, only to learn that you need to add new (and more complex) functionality a few months before your targeted tapeout. How can you deliver the performance and capabilities expected in the same timeframe? For Bosch, high-level synthesis (HLS) provided the solution. In this paper, we will discuss how HLS technology enabled the team to meet an aggressive sche... » read more

Assessing ESD Sensitivity Of Interface IP Using Charged Device Model


An electronic device is susceptible to Electrostatic Discharge (ESD) damage during its entire life cycle, especially from the completion of the silicon wafer processing to when the device is assembled in the system. The most commonly used ESD test models are the Human Body Model (HBM) and the Charged Device Model (CDM). Both models assess the ESD sensitivity of a device, however due to the rapi... » read more

System Performance Analysis At ARM


Performance analysis is a vital task in modern SoC design. An under-designed SoC may run too slowly to keep up with the demands of the system. An over-designed SoC will consume too much power and require more expensive IP blocks. At ARM we want to help our partners build SoCs that deliver the best performance within their power and area budgets. The simple truth is that this is more difficul... » read more

Optimizing Multiple IoT Layers


As the number of connected devices rises, so do questions about how to optimize them for target markets, how to ensure they play nicely together, and how to bring them to market quickly and inexpensively. [getkc id="76" kc_name="IoT"] is broad term that encompasses a lot of disparate pieces for devices, systems, and connected systems. At the highest levels are hardware and software, but with... » read more

7nm Design Success Starts With Multi-Domain Multi-Physics Analysis


Companies can benefit from advancements in the latest semiconductor process technology by delivering smaller, faster and lower power products, especially for those servicing mobile, high performance computing and automotive ADAS applications. By using 7nm processes, design teams are able to add a lot more functionality onto a single chip and lower the power consumption by scaling operating volt... » read more

Formal’s Roadmap


Formal verification has come a long way in the past five years as it focused on narrow tasks within the verification flow. Semiconductor Engineering sat down to discuss that progress, and the future of formal technologies, with [getperson id="11306" comment="Raik Brinkmann"], president and CEO of [getentity id="22395" e_name="OneSpin Solutions"]; Harry Foster, chief verification scientist at [g... » read more

Making 2.5D, Fan-Outs Cheaper


Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

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