Challenges At Advanced Nodes

By Ed Sperling - 19 Aug, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss finFETs, 22nm FD-SOI and how the how the market will segment over the next few years with Marie Semeria, CEO of [getentity id="22192" e_name="Leti"]; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Paul Boudre, CEO of Soitec; and Subramani Kengeri, vice president of global ... » read more

Fundamental Shifts In Chip Business

By Ed Sperling - 17 Aug, 2015 - Comments: 3

Shifting business models, acquisitions, minority investments and increasing uncertainty are creating fundamental shifts in the semiconductor industry that could redefine who is successful in which markets for years to come. The announcement today that [getentity id="22671" e_name="Rambus"] is developing memory controller chips, expanding its business beyond just creating IP for the memory an... » read more

Tech Talk: 4K Screen Design

By Ed Sperling - 13 Aug, 2015 - Comments: 0

Hezi Saar, MIPI IP product manager at Synopsys, talks about how to design high-resolution displays for mobile devices and what can go wrong. [youtube vid=rQKNM0CABM0] » read more

Poised For Aspect-Oriented Design?

By Brian Bailey - 13 Aug, 2015 - Comments: 8

In 1992, [getperson id=" 11046 " comment="Yoav Hollander"] had the idea to take a software programming discipline called aspect-oriented programming (AOP) and apply it to the verification of hardware. Those concepts were incorporated into the [gettech id="31021" t_name="e"] language and [getentity id="22068" e_name="Verisity"] was formed to commercialize it. Hollander had seen that using obj... » read more

Using Automotive-Ready IP To Accelerate SoC Development

By Ron DiGiuseppe - 13 Aug, 2015 - Comments: 0

IP suppliers play a key role in the automotive supply chain to enable high-performance advanced driver assistance system (ADAS) SoCs. Vision-based SoCs may contain a high amount of third-party IP to implement the key embedded vision, sensor fusion, multimedia, security and advanced connectivity functions. And while IP suppliers have permeated the semiconductor ecosystem for consumer, mobile, PC... » read more

Executive Insight: Aart de Geus

By Ed Sperling - 10 Aug, 2015 - Comments: 0

Aart de Geus, chairman and co-CEO of Synopsys, sat down with Semiconductor Engineering to talk about acquisitions, software and EDA. What follows are excerpts of that interview, which was conducted in front of a live audience at DAC. SE: A lot of Synopsys' investments are moving in a new direction, namely software. Why is that becoming so important to your company? De Geus: It's not a dif... » read more

How IoE Will Alter Supply Chains

By Ernest Worthman - 06 Aug, 2015 - Comments: 0

Globalization is a double-edged sword. Without a doubt, it nourishes competition, offers a plethora of independent sources, and bounty of supplies from a global pool of vendors. That is the good side. The downside is that control becomes a management nightmare. Well-oiled, traditional supply chains systems will have to be redesigned to function across a variety of variables that can interrupt t... » read more

Cryptography For ULP Devices

By Ernest Worthman - 06 Aug, 2015 - Comments: 0

Soon virtually everything and everyone will be connected to the IoE in one fashion or another, and much of it will be wireless. To make it all work, these wireless, and low-power devices will need a new paradigm for handling cryptography. Ultra-low power devices have an interesting, and challenging set of metrics. There are, in general, two approaches that can work, with a variety of sub-sce... » read more

The Future Of Moore’s Law

By Ed Sperling - 03 Aug, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss the future of Moore's Law with Jan Rabaey, Donald O. Pederson distinguished professor at [getentity id="22165" comment="UC Berkeley"]; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at [getentity id="22819" comment="GlobalFoundries"]; Charlie Cheng, CEO of [getentity id="2... » read more

Who’s Calling The Shots

By Ann Mutschler - 31 Jul, 2015 - Comments: 0

Throughout the PC era and well into the mobile phone market, it was semiconductor companies that called the shots while OEMs followed their lead and designed systems around chips. That’s no longer the case. A shift has been underway over the past half decade, and continuing even now, to reverse that trend. The OEM — or systems company as it is more commonly called today — now determine... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.