Research Bits: Mar. 5


Anti-ambipolar transistor Materials scientists from the City University of Hong Kong propose using transistors made of mixed-dimensional nanowires and nanoflakes to create multivalued logic devices. By combining GaAsSb nanowires and MoS2 nanoflakes, the team created a hetero-transistor with anti-ambipolar transfer characteristics, in which positive (holes) and negative (electron) charge car... » read more

Efficient Streaming Language Models With Attention Sinks (MIT, Meta, CMU, NVIDIA)


A technical paper titled “Efficient Streaming Language Models with Attention Sinks” was published by researchers at Massachusetts Institute of Technology (MIT), Meta AI, Carnegie Mellon University (CMU), and NVIDIA. Abstract: "Deploying Large Language Models (LLMs) in streaming applications such as multi-round dialogue, where long interactions are expected, is urgently needed but poses tw... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Research Bits: Jan. 30


Etching tellurite glass Physicists from EPFL and Tokyo Tech propose a way to create photoconductive circuits, where the circuit is directly patterned onto a tellurite glass surface with femtosecond laser light. The exposure formed nanoscale tellurium and tellurium oxide crystals, both semiconducting materials. “Tellurium being semiconducting, based on this finding we wondered if it would ... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Chip Industry’s Technical Paper Roundup: Jan. 8


New technical papers added to Semiconductor Engineering’s library this week. [table id=183 /] More ReadingTechnical Paper Library home » read more

Superconducting Material With Exceptional Tunability


A technical paper titled “Strain-switchable field-induced superconductivity” was published by researchers at Massachusetts Institute of Technology (MIT), University of Washington, Argonne National Laboratory, Cornell University, Zhejiang University of Science and Technology, and George Mason University. Abstract: "Field-induced superconductivity is a rare phenomenon where an applied magne... » read more

Research Bits: Jan. 2


Synaptic transistor Researchers from Northwestern University, Boston College, and MIT developed a synaptic transistor that simultaneously processes and stores information similar to the human brain. The team said the transistor goes beyond simple machine learning tasks to categorize data and is capable of performing associative learning. The new device is stable at room temperatures. It als... » read more

Research Bits: Dec. 18


Stacking 2D layers for AI processing Researchers from Washington University in St. Louis, MIT, Yonsei University, Inha University, Georgia Institute of Technology, and the University of Notre Dame demonstrated monolithic 3D integration of layered 2D material, creating a novel AI processing hardware that integrates sensing, signal processing, and AI computing functions into a single chip. Th... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Synopsys acquired Imperas, pushing further into the RISC-V world with Imperas' virtual platform technology for verifying and emulating processors. Synopsys has been building up its RISC-V portfolio, starting with ARC-V processor IP and a full suite of tools introduced last month. The first high-NA EUV R&D center in the U.S. will be built at... » read more

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