tag: packaging

The Future Of MEMS Sensor Design And Manufacturing
By Stephen Breit - 21 Apr, 2016 - Comments: 0

I recently gave an invited talk at the IEEE Inertial Sensors 2016 symposium that discussed the future of commodity MEMS inertial sensor design and manufacturing. Inertial sensors comprise one of the fastest growing and most successful segments of the MEMS market. There are three industry trends that I believe will have major implications for motion sensor design and manufacturing and, more g... » read more

Samsung Foundry’s Business Strategy
By Kelvin Low - 21 Apr, 2016 - Comments: 0

Wow! 2016 is off to a fast start. While visiting headquarters in Korea recently, I sat down with four members of Samsung Foundry’s global leadership team to discuss several key initiatives this year. Below are key excerpts from those conversations. Samsung Foundry’s Business Strategy Q: Can you expand on some of the macro business trends affecting the fabless/foundry industry? Jong S... » read more

Have Margins Outlived Their Usefulness?
By Aveek Sarkar - 20 Apr, 2016 - Comments: 0

To automate the process of solving complex design problems, the traditional approach has been to partition them into smaller, manageable tasks. For each task, we have built the best possible solution which we continuously refine over time. Additionally, we have managed the interdependencies between tasks by defining boundaries or margins; these often have been best- and worst-case values used t... » read more

China: Strong Market Growth And Innovation In Packaging
By SEMI - 17 Mar, 2016 - Comments: 0

By Shanshan Du Since the mid-1980s, packaging and assembly have been key segments of the semiconductor supply chain in China. In the past decade, the fast growing market of electronic product manufacturing in China occurred concurrently with the innovation and growth in China for packaging and assembly. SEMI China researched the packaging and assembly industry segment and observed a total... » read more

Inside The OSAT Business
By Mark LaPedus - 17 Mar, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the IC-packaging industry, foundries, China and other topics with Tien Wu, chief operating officer at Taiwan's Advanced Semiconductor Engineering (ASE), the world's largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What is your overall outlook for 2016? Wu: Last year, the semi... » read more

Tech Talk: 2.5D Issues
By Ed Sperling - 25 Feb, 2016 - Comments: 0

Bill Isaacson, director of ASIC marketing at eSilicon, about how viable this packaging approach is, organic vs. inorganic interposers, where the problems are, thermal coupling, interposer cost, and what will change over the next couple years. » read more

The Big Shift
By Ed Sperling - 18 Feb, 2016 - Comments: 0

The number of chipmakers that truly can differentiate their products by moving to the next process node is falling, and that pool will continue to shrink even further over the next few years. Processor companies such as Intel and IBM always will benefit from scaling and architectural changes. So will GPU companies such as Nvidia, and FPGA vendors such as Xilinx, Microsemi and Altera (now par... » read more

Why Use A Package?
By Ed Sperling - 21 Jan, 2016 - Comments: 0

Subramanian Iyer, distinguished chancellor's professor in UCLA's Electrical Engineering Department—and a former fellow and director of the systems scaling technology department at IBM—sat down with Semiconductor Engineering to talk about the future of chip scaling. What follows are excerpts of that conversation. SE: Advanced packaging is being viewed as a way to extend scaling in the fut... » read more

Blog Review: Jan. 20
By Jesse Allen - 20 Jan, 2016 - Comments: 0

How far can you go on solar power? 493 million miles, at least if you're the Juno spacecraft. Plus, winemaking gets a boost from submarine technology, in this week's top tech picks from Ansys' Bill Vandermark. Mentor's Steve Pateras digs into how automotive ICs bring a whole new set of requirements that are driving the evolution of memory BIST. If you're interested in neural networks and ... » read more

Executive Insight: Sehat Sutardja
By Ed Sperling - 11 Jan, 2016 - Comments: 1

Sehat Sutardja, chairman and CEO of Marvell, sat down with Semiconductor Engineering to talk about new approaches for design and memory and why costs and time to market are forcing changes in Moore's Law. What follows are excerpts of that conversation. SE: What was behind your move into modular packaging? Sutardja: The cost of building chips is getting out of hand. As we make things more ... » read more

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