How ready is this packaging approach and what problems remain?
Bill Isaacson, director of ASIC marketing at eSilicon, about how viable this packaging approach is, organic vs. inorganic interposers, where the problems are, thermal coupling, interposer cost, and what will change over the next couple years.
Sensor technologies are still evolving, and capabilities are being debated.
Academia, industry partnerships ramp to entice undergrads into hardware engineering.
Pitches continue to decrease, but new tooling and technologies are required.
Buried features and re-entrant geometries drive application-specific metrology solutions.
Issues involving design, manufacturing, packaging, and observability all need to be solved before this approach goes mainstream for many applications.
While terms often are used interchangeably, they are very different technologies with different challenges.
Technology and business issues mean it won’t replace EUV, but photonics, biotech and other markets provide plenty of room for growth.
Commercial chiplet marketplaces are still on the distant horizon, but companies are getting an early start with more limited partnerships.
Existing tools can be used for RISC-V, but they may not be the most effective or efficient. What else is needed?
Sensor technologies are still evolving, and capabilities are being debated.
The industry is gaining ground in understanding how aging affects reliability, but more variables make it harder to fix.
Key pivot and innovation points in semiconductor manufacturing.
Tools become more specific for Si/SiGe stacks, 3D NAND, and bonded wafer pairs.
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