tag: high-bandwidth memory

DRAM Tradeoffs: Speed Vs. Energy
By Ed Sperling - 31 Jul, 2019 - Comments: 1

Semiconductor Engineering sat down to talk about new DRAM options and considerations with Frank Ferro, senior director of product management at Rambus; Marc Greenberg, group director for product marketing at Cadence; Graham Allen, senior product marketing manager for DDR PHYs at Synopsys; and Tien Shiah, senior manager for memory marketing at Samsung Electronics. What follows are excerpts of th... » read more

Memory Options And Tradeoffs
By Ed Sperling - 13 Jun, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, talks with Semiconductor Engineering about different memory options, why some are better than others for certain tasks, and what the tradeoffs are between the different memory types and architectures.     Related Articles/Videos Memory Tradeoffs Intensify In AI, Automotive Applications Why choosing memories and archi... » read more

HBM2 Vs. GDDR6: Tradeoffs In DRAM
By Ed Sperling - 13 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to talk about new DRAM options and considerations with Frank Ferro, senior director of product management at Rambus; Marc Greenberg, group director for product marketing at Cadence; Graham Allen, senior product marketing manager for DDR PHYs at Synopsys; and Tien Shiah, senior manager for memory marketing at Samsung Electronics. What follows are excerpts of th... » read more

Focus Shifting From 2.5D To Fan-Outs For Lower Cost
By Ed Sperling - 29 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

Lithography Challenges For Fan-out
By Mark LaPedus - 12 Feb, 2019 - Comments: 3

Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density fan-out packages are migrating toward the 1µm line/space barrier and beyond, which is considered a milestone in the industry. At these critical dimensions (CDs), fan-outs will provide better per... » read more

Making Sense Of DRAM
By Ed Sperling - 13 Dec, 2018 - Comments: 0

Graham Allan, senior manager for product marketing at Synopsys, examines the different types of DRAM, from GDDR to HBM, which markets they’re used in, and why there is such disparity between them. https://youtu.be/ynvcPfD2cZU     __________________________________ See more tech talk videos here. » read more

Cloud Drives Changes In Network Chip Architectures
By Ann Steffora Mutschler - 03 Oct, 2018 - Comments: 0

Cloud data centers have changed the networking topology and how data moves throughout a large data center, prompting significant changes in the architecture of the chips used to route that data and raising a whole new set of design challenges. Cloud computing has emerged as the fast growing segment of the data center market. In fact, it is expected to grow three-fold in the next few years, a... » read more

Using High-Bandwidth Memory
By Ed Sperling - 01 Oct, 2018 - Comments: 0

eSilicon’s Tim Horel talks about HBM, what engineers need to know to work with this technology, and how it integrates with ASICs at advanced nodes. https://youtu.be/0Yq2XHGF6UE » read more

Processing In Memory
By Ed Sperling - 05 Sep, 2018 - Comments: 1

Adding processing directly into memory is getting a serious look, particularly for applications where the volume of data is so large that moving it back and forth between various memories and processors requires too much energy and time. The idea of inserting processors into memory has cropped up intermittently over the past decade as a possible future direction, but it was dismissed as an e... » read more

Measuring And Analyzing SoC Performance With Verdi Performance Analyzer
By Synopsys - 23 May, 2018 - Comments: 0

SoC performance is a key competitive advantage in the marketplace. The choice and configuration of SoC components—protocol IP and interconnects, is geared towards maximizing overall SoC performance. A case in point is the use of HBM (High Bandwidth Memory) technology and controllers. Currently in its third generation, HBM boasts high-performance while using less power in a substantially small... » read more

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