Adaptive Test Gaining Ground For HPC And AI Chips


Adaptive test is starting to gain traction for high-performance computing and AI chips as test programs that rely on static limits and fixed test sequences reach their practical limits. The growing complexity of multi-die assemblies and power delivery, along with increased stresses, are forcing a shift toward real-time, data-driven optimization at the test cell. “It’s the same old pro... » read more

Invisible Interfaces: The Hidden Challenge Behind Every Great Image Sensor


When you snap a photo on your phone or rely on a car’s camera for lane detection, you’re trusting an unseen network of technologies to deliver or interpret image data flawlessly. But behind the scenes, the interface between the image sensor and its processor is doing the heavy lifting, moving megabtyes of data without error or delay. While much of the industry conversation focuses on adv... » read more

Boosting Production Performance: Ensuring Only Known-Good Sockets Enter Your Line


Efficient, stable, and high-yield semiconductor production depends on one often-overlooked factor: the health of your test sockets. In many factories, socket maintenance and inspection practices haven't kept pace with the demands of today’s high-density, high-speed packages. The result? Hidden marginal pins, unexpected downtime, multisite yield variation, and inflated manufacturing costs. ... » read more

Beyond The Core: Tackling System-Wide Debugging For Complex SoCs


The world of System-on-Chips (SoCs) is evolving – with the advancement of generative AI, the increasing demand for high-performance compute, and the innovative shift towards multi-chiplet architectures, system complexity is advancing at an increased pace. And with complexity comes an even greater challenge: debugging complexity. Silent data corruption, elusive timing-sensitive bugs, and i... » read more

Tackling Chip Complexity With Integrated System-Level Test Solutions


As the sophistication of semiconductors continues to grow, so does the need for system-level test (SLT) in production to ensure that high-performance processors, chiplets, and other advanced devices function as expected in real-world environments. Once seen primarily as a fallback to catch what traditional automated test equipment (ATE) missed, SLT has now become a mission-critical step for val... » read more

Beyond The Bottleneck: 3 Breakthroughs In High-Throughput Connector Testing


By Reagan Oliver and Jesse Ko Ensuring the quality of mass-produced electronic connectors without creating a production bottleneck remains a persistent challenge in manufacturing. As demand for speed and reliability increases, innovative testing solutions are emerging to meet this need head-on. This article breaks down three key breakthroughs in modern connector testing technology based on a... » read more

AI Memory: Enabling The Next Era Of High-Performance Computing


The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in high-bandwidth memory (HBM). However, as AI models grow in complexity—from large language models (LLMs) to real-time inference applications—the need for faster, higher-bandwidth, and energy-effici... » read more

Solving Today’s Toughest Test Challenges: A New Era Of Engineering Productivity


Today’s test engineers face unprecedented demands as semiconductor designs grow more complex and product cycles accelerate. Advanced packaging, chiplet architectures, and AI accelerators are reshaping the landscape, yet engineering resources remain fixed. Traditional approaches to scaling productivity by adding headcount no longer apply. While cost of test is always a consideration, ensuri... » read more

Integrating Design Verification To Approach Zero Defects


As semiconductor applications in automotive, data center, and high-performance computing grow increasingly mission-critical, the industry faces mounting pressure to achieve near-perfect manufacturing test coverage—often exceeding 99%. Yet, meeting stringent zero-defect defective parts per million (DPPM) targets remains a formidable challenge. Traditional structural testing methods frequently ... » read more

Expanding The Scope Of Testing In Complex Systems


Semiconductor devices now anchor the world’s most demanding infrastructures—from hyperscale data centers to advanced automotive platforms and industrial control systems. At scale, even rare faults can have significant cumulative impact, and the downstream consequences of failure extend far beyond a single board or rack. Unplanned outages translate into lost revenue, contractual penalties, f... » read more

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