tag: verification

New Innovative Way To Functionally Verify Heterogeneous 2D/3D Package Connectivity
By Siemens EDA - 12 Mar, 2025 - Comments: 0

Historically, IC package design has been a relatively simple task which allowed the die bumps to be fanned out to a geometry suitable for connecting to a printed circuit board. The package netlist was often captured by the package designer, typically using Excel to manually assign net names to the desired die bumps and BGA balls to achieve the intended connection. Modern package and interpos... » read more

Shift-Left Pattern Matching Boosts Automotive IC Quality And Time-To-Market
By John Muirhead - 06 Mar, 2025 - Comments: 0

As the automotive industry races towards a future of connected, autonomous, and electrified vehicles, the complexity of integrated circuits (ICs) powering these innovations is reaching unprecedented levels. Modern automotive ICs incorporate a diverse mix of custom and third-party intellectual property (IP), each with unique performance requirements that must be meticulously verified to ensure f... » read more

Shift Left With Calibre Pattern Matching
By Siemens EDA - 06 Mar, 2025 - Comments: 0

As integrated circuit (IC) designs become increasingly complex, early-stage verification is crucial to ensure productivity and quality in design processes. The "shift left" verification approach, enabled by Siemens’ Calibre nmPlatform, helps IC design teams to identify and resolve critical issues much earlier in the design cycle. As part of the shift left platform, Calibre Pattern Matching... » read more

Scenario Coverage In Formal Verification
By Ed Sperling - 05 Mar, 2025 - Comments: 0

A rapid increase in complexity with heterogeneous assemblies and advanced-node chips is raising all sorts of questions on the formal verification side about the completeness of coverage. Engineers may assume proofs are complete, but in many cases they're black boxes that provide little or no insights into what's actually being proven. This is where scenario coverage comes into play. Ashish Darb... » read more

The Price Of Fear
By Brian Bailey - 27 Feb, 2025 - Comments: 0

In my last blog, I talked about how pain is important when making predictions in the semiconductor industry. Pain is related to time to market and risk, and the flip side of risk is fear. Fear is one of the main drivers for a large number of EDA tools, such as those related to verification. The fear is taping out a chip, then waiting for what seems like an eternity to get the first chips bac... » read more

Simplifying HW/SW Co-Verification With PSS Led UVM And C Tests
By Todd Burkholder - 27 Feb, 2025 - Comments: 0

By Todd Burkholder, Wael Abdelaziz Mahmoud, Tom Fitzpatrick, Vishal Baskar, and Mohamed Nafea The complexity of system on chips (SoCs) continues to grow rapidly with the integration of more functionality onto a single chip. As a result, traditional verification methodologies struggle to keep pace with the growing complexities, leading to longer development cycles and increased risk of design... » read more

Improving Verification Methodologies
By Brian Bailey - 27 Feb, 2025 - Comments: 0

Methodology improvements and automation are becoming pivotal for keeping pace with the growing complexity and breadth of the tasks assigned to verification teams, helping to compensate for lagging speed improvements in the tools. The problem with the tools is that many of them still run on single processor cores. Functional simulation, for example, cannot make use of an unlimited number of c... » read more

A Novel Approach For Hardware-Software Co-Verification
By Siemens EDA - 26 Feb, 2025 - Comments: 0

The complexity of system on chips (SoCs) continues to grow rapidly. Accordingly, new standards and methodologies are introduced to overcome these verification challenges. The Portable Test and Stimulus Standard (PSS) from Accellera is one of the standard examples used to pursue such challenges. In this paper we will show a methodology to use PSS to orchestrate the process of HW/SW co-verificati... » read more

Pre-Silicon Verification Of Die-to-Die IP With Novel ESD Protection
By Synopsys - 26 Feb, 2025 - Comments: 0

All major foundries have adopted the programmable electrical rule checker (PERC) as the pre-silicon electrostatic discharge (ESD) signoff tool for IP and chip designs. This concept of rule checking works fine for most IP types, but for die-to-die IP, used in 3DIC designs, the PERC approach may not be appropriate. Die-to-die interface IP includes extremely large numbers of I/Os, trending towards... » read more

Beyond Simulation: Transforming Early IC Design With Insight Analyzer
By Siemens EDA - 13 Feb, 2025 - Comments: 0

Traditional verification methods are proving inadequate for addressing critical reliability challenges in today's increasingly complex integrated circuit (IC) designs. Modern IC design requires a proactive approach to verification that emphasizes early-stage analysis. The shift-left methodology enables earlier identification of potential design risks, addressing the complex challenges of IP blo... » read more

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