How Much Security Is Enough?

By Ed Sperling - 06 Jul, 2015 - Comments: 3

Semiconductor Engineering sat down to discuss the current state of [getkc id="223" kc_name="security"] and what must be done in the future, with Denis Noël, head of cyber security solutions at [getentity id="22499" e_name="NXP"]; Serge Leef, vice president of new ventures at [getentity id="22017" e_name="Mentor Graphics"]; Andreas Kuehlman, senior vice president and general manager of the soft... » read more

Week 50: It’s Not Just A Technical Conference, It’s An Ecosystem

By Anne Cirkel - 22 May, 2015 - Comments: 0

While our free “I love DAC” registration comes to an end this week, there are still a few weeks left to register for the full conference, the designer and IP track, or one of the many co-located events at DAC (see below). Over the last year I’ve been reminded often about the unique niche occupied by DAC. Just last week a good friend was trying to find an industry event in the greater EDA ... » read more

Week 47: The Yin And Yang of DAC

By Anne Cirkel - 01 May, 2015 - Comments: 0

In one of my early blog posts I explained that DAC is owned by three non-profit societies: ACM, IEEE/CEDA and EDAC. While the executive committee right now is working on a successful 52nd DAC, planning for future events has already started. Future locations are usually booked years in advance as most of convention center and hotel contracts are signed at least 18 months out. The financial liabi... » read more

Who Owns DAC?

By Anne Cirkel - 01 Aug, 2014 - Comments: 4

In June I was chatting with an editor unfamiliar with DAC and he was wondering who owns the conference. It’s a fair question and I recall thinking I’d blog about it as part of my effort to boost understanding of DAC. After all, my goal is to let you glimpse behind the curtain and that means touching on the prosaic though very important issue of ownership. First, the basics. DAC is owne... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ACM

How Much Security Is Enough?

Week 50: It’s Not Just A Technical Conference, It’s An Ecosystem

Week 47: The Yin And Yang of DAC

Who Owns DAC?