Metrology And Inspection For The Chiplet Era


New developments and innovations in metrology and inspection will enable chipmakers to identify and address defects faster and with greater accuracy than ever before, all of which will be required at future process nodes and in densely packed assemblies of chiplets. These advances will affect both front-end and back-end processes, providing increased precision and efficiency, combined with a... » read more

SiC Growth For EVs Is Stressing Manufacturing


The electrification of vehicles is fueling demand for silicon carbide power ICs, but it also is creating challenges in finding and identifying defects in those chips. Coinciding with this is a growing awareness about just how immature SiC technology is and how much work still needs to be done — and how quickly that has to happen. Automakers are pushing heavily into electric vehicles, and t... » read more

Application For Non-Destructive Inspection


IC chip internal measurement We attempted to apply the Hadatomo Z photoacoustic microscope for non-destructive inspection. One of the features of the HadatomoTM Z is simultaneous measurement using photoacoustic imaging and ultrasound imaging. By using an ultrasonic sensor with cen- ter frequency of 60 MHz, high-resolution imaging is possible. Photoacoustic imaging is a method to re... » read more

Striking A Balance In Acoustic Inspection


Sound energy is a quick way to to spot voids, delamination, cracks, and other possible defects that are accessible from outside the chip or package, as well as some defects that are inside of chips. But acoustic inspection also is highly sensitive to different materials with different polarities, which can change the reflection of sound waves. Bill Zuckerman, product marketing manager at Nordso... » read more