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Week In Review: Manufacturing, Test


Chipmakers Earlier this year, the semiconductor industry saw little merger and acquisition activity. More recently, though, there has been a flurry of deals. In July, ADI moved to acquire Maxim. Then, Nvidia announced plans to acquire Arm for $40 billion, followed by AMD’s proposed move to buy Xilinx for $35 billion. Not to be outdone, Marvell has announced plans to buy Inphi. Companies a... » read more

Regaining The Edge In U.S. Chip Manufacturing


The United States is developing new strategies to prevent it from falling further behind Korea, Taiwan, and perhaps even China in semiconductor manufacturing, as trade tensions and national security concerns continue to grow. For years, the U.S. has been a leader in the development of new chip products like GPUs and microprocessors. But from a chip manufacturing standpoint, the U.S. is losin... » read more

Impact Of EUV Resist Thickness On Local Critical Dimension Uniformities For <30nm CD Via Patterning


This paper describes the impact of extreme ultraviolet (EUV) resist thickness on <30 nm via local critical dimension uniformity (LCDU) measured during after development inspection (ADI) and after etch inspection (AEI). For the same post-etch CD targets, increasing resist thickness from 40 to 60 nm helped reduced CD variability. This work was performed via virtual fabrication using Coventor... » read more

Deals That Change The Chip Industry


Nvidia's pending $40 billion acquisition of Arm is expected to have a big impact on the chip world, but it will take years before the effects of this deal are fully understood. More such deals are expected over the next couple of years due to several factors — there is a fresh supply of startups with innovative technology, interest rates are low, and market caps and stock prices of buyers ... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs As reported, Intel this week reorganized its operations following delays with its 7nm technology. Intel is behind TSMC and Samsung in technology. As a result, TSMC’s foundry customers, such as AMD, Nvidia and others, are also pulling ahead of Intel. In addition, reports have surfaced that Intel will outsource some of its leading-edge chip production to TSMC. To solve t... » read more

Week In Review: Design, Low Power


Analog Devices (ADI) acquired the HDMI business of Invecas. “The acquisition of Invecas' HDMI business positions ADI to deliver more complete solutions throughout the entire customer journey – from chip, to certification, to end product," said John Hassett, Senior Vice President, Industrial and Consumer at Analog Devices. "We are thrilled to enhance ADI’s capabilities with the addition of... » read more

Week In Review: Design, Low Power


Siemens will acquire Avatar Integrated Systems. The company's place-and-route tools, which will become part of Mentor's Xcelerator portfolio, include a netlist-to-GDS full-function block-level physical implementation tool and a complete top-level prototyping, floor-planning and chip assembly tool. Based in Santa Clara, CA, Avatar was formed in 2017 from the acquired assets of ATopTech. ATopTech... » read more

Week In Review: Manufacturing, Test


Market research After years of falling demand, the PC market is back. The second quarter of 2020 ended well for the traditional PC market, including desktops, notebooks, and workstations. Global PC shipments jumped 11.2% year-over-year reaching a total of 72.3 million units, according to IDC. As restrictions around the world tightened in the first few weeks of the quarter, demand for notebo... » read more

Week In Review: Manufacturing, Test


Fab tools and test KLA has announced the formation of a new business group for its Electronics, Packaging and Components (EPC) businesses. The new EPC group includes the ICOS, Orbotech and the SPTS Technologies organizations. The group will be headed by Oreste Donzella, KLA’s executive vice president. In 2018, KLA acquired Orbotech for $3.4 billion, a deal that included two organizations-... » read more

The Impact Of EUV Resist Thickness On Via Patterning Uniformity


Via patterning at advanced nodes requires extremely low critical dimension (CD) values, typically below 30nm. Controlling these dimensions is a serious challenge, since there are many inherent sources of variation during lithography and etch processing. Coventor personnel, in conjunction with our colleagues from ASML and imec, recently looked at the impact of Extreme Ultraviolet lithography (EU... » read more

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