tag: advanced packaging

First-Time Silicon Success Plummets
By Ed Sperling - 27 Mar, 2025 - Comments: 0

First-time silicon success is falling sharply due to rising complexity, the need for more iterations as chipmakers shift from monolithic chips to multi-die assemblies, and an increasing amount of customization that makes design and verification more time-consuming. Details from a new functional verification survey[1] highlight the growing difficulty of developing advanced chips that are both... » read more

Big Changes Ahead For Interposers And Substrates
By Gregory Haley - 24 Mar, 2025 - Comments: 1

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and signal integrity in the most advanced computing systems. This shift is being driven by AI, high-performance computing (HPC), and next-generation communications, where the need for heterogeneous ... » read more

AI And Semiconductor In Reciprocity
By Mike Hung - 20 Mar, 2025 - Comments: 0

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drive the development of semiconductor technologies, with both complementing each other. Semiconductor packaging: The bridge between chip an... » read more

The Rise Of Thin Wafer Processing
By Laura Peters - 20 Mar, 2025 - Comments: 0

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the amount of energy needed to drive them. Markets calling for ultrathin wafers are growing. The combined thickness of an HBM module with 12 DRAM dies and a base logic chip is still less than that of a ... » read more

Sustainable AI Systems For Energy-Efficient Computing
By Pushkar Apte - 20 Mar, 2025 - Comments: 0

By Pushkar Apte, Jim Sexton, and Melissa Grupen-Shemansky The world is abuzz with the new opportunities being created by artificial intelligence (AI), enabled by the availability of unprecedented amounts of data. AI runs on the semiconductor engine, and in turn, creates a rising demand for semiconductor chips. The semiconductor industry is predicted to reach $1 trillion in revenue by 2030 ... » read more

Optimizing Data Movement In SoCs And Advanced Packages
By Ed Sperling - 18 Mar, 2025 - Comments: 0

The amount of data that needs to move around a chip is growing exponentially, driven by the rollout of AI and more sensors everywhere. There may be hundreds of IP blocks, more compute elements, and many more wires to contend with. Andy Nightingale, vice president of product management and marketing at Arteris, talks about the demand for low-latency on-chip communication in increasingly complex ... » read more

Chiplets Add New Power Issues
By Ann Mutschler - 13 Mar, 2025 - Comments: 0

Delivering and managing power are becoming key challenges in the rollout of chiplets, adding significantly to design complexity and forcing chipmakers to weigh tradeoffs that can have a big impact on the performance, reliability, and the overall cost of semiconductors. Power is a concern for every chip and chiplet design, even if the specifics differ based on the application. Systems vendors... » read more

New Innovative Way To Functionally Verify Heterogeneous 2D/3D Package Connectivity
By Siemens EDA - 12 Mar, 2025 - Comments: 0

Historically, IC package design has been a relatively simple task which allowed the die bumps to be fanned out to a geometry suitable for connecting to a printed circuit board. The package netlist was often captured by the package designer, typically using Excel to manually assign net names to the desired die bumps and BGA balls to achieve the intended connection. Modern package and interpos... » read more

Challenges Grow For Medical ICs
By Gregory Haley - 03 Mar, 2025 - Comments: 0

Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. Few semiconductor applications demand this level of precision, reliability, and long-term stability. Unlike consumer electronics, where failure might mean a reboot or chip re... » read more

Lines Blurring Between Supercomputing And HPC
By Ann Mutschler - 27 Feb, 2025 - Comments: 1

Supercomputers and high-performance computers are becoming increasingly difficult to differentiate due to the proliferation of AI, which is driving huge performance increases in commercial and scientific applications and raising similar challenges for both. While the goals of supercomputing and high-performance computing (HPC) have always been similar — blazing fast processing — the mark... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy