tag: Advantest

Let’s Be Smart About Artificial Intelligence
By Judy Davies - 06 Nov, 2017 - Comments: 0

Technology visionaries no less than Stephen Hawking and Elon Musk have called artificial intelligence (AI) the greatest threat facing the future of mankind. But unless we all wind up running for our lives from a “Terminator” killing machine, don’t the benefits of AI far outweigh the downsides? Looking past purely mathematic calculators from the abacus to Charles Babbage’s difference ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Oct, 2017 - Comments: 0

Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others are developing a next-generation fan-out technology using a panel-level format. In panel-level fan-out packaging, you can put more die on a panel as compared to a traditional round wafer, w... » read more

Memory Test Challenges, Opportunities
By Jeff Dorsch - 18 Oct, 2017 - Comments: 0

The semiconductor capital equipment market is on fire, and the memory chip test equipment sector is no different. But it is getting much more difficult on the memory side. Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAM... » read more

The 2017 International Test Conference
By Jeff Dorsch - 09 Oct, 2017 - Comments: 0

Machine learning is a hot topic at many technical conferences this year. It will be true at the upcoming International Test Conference, which opens near the end of this month in Fort Worth, Texas. On Sunday, October 29, there are two tutorials devoted to machine learning. Monday, October 30, will have one tutorial related to the topic. The conference gets fully under way on Halloween, wit... » read more

Toward System-Level Test
By Ed Sperling - 09 Oct, 2017 - Comments: 0

The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most people think of test as a single operation that is performed during manufacturing. In reality it is a portfolio of separate operations, and the number of tests required is growing as designs become more heterogeneous and as they ar... » read more

The Future Of Human/Machine Interaction Is Personal
By Judy Davies - 09 Oct, 2017 - Comments: 0

What comes to mind when you think of a human/machine interface? Something close at hand like your smartphone’s GPS and the ATMs at your bank? Something futuristic like flying cars and jetpacks? Something dangerous like menacing cyborgs? As technology becomes more pervasive in our everyday activities, there are a growing number of human/machine interfaces. They also are becoming more personal.... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Sep, 2017 - Comments: 0

Chipmakers Who will buy Toshiba’s memory business? In the latest of what is becoming a confusing saga, Toshiba has signed a deal to sell its memory unit to a group led by Bain Capital. The Bain-led consortium will hold a 49.9% stake in the memory unit, while Toshiba will hold 40.2% and Japan’s Hoya will own 9.9%. Other members in the group include Apple, Dell, Kingston, and Seagate. In add... » read more

The Future of Testing
By Jeff Dorsch - 08 May, 2017 - Comments: 0

In our previous test blog posts, we looked at the history of automated test equipment for semiconductors and for printed circuit boards. This month, we look ahead to the test technologies that are emerging. The chip ATE field has essentially boiled down to Advantest, Teradyne, and Xcerra (LTX-Credence), while the board test market is dominated by Teradyne and Keysight Technologies (formerly ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Apr, 2017 - Comments: 0

Fab equipment and test VLSI Research has released its top 10 semiconductor equipment supplier ranking in terms of sales in 2016. Applied Materials topped the list again, achieving a growth of 18%. ASML was second, followed by Lam Research, TEL and KLA-Tencor. Fig. 1: Ranking based on 2016 sales. Source: VLSI Research. Unic Capital Management, a Chinese-based private equity fund, announ... » read more

Time For Massively Parallel Testing
By Jeff Dorsch - 12 Apr, 2017 - Comments: 0

Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

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