tag: Advantest

The Hidden Cost Of Contact Resistance
By Gregory Haley - 09 Sep, 2025 - Comments: 1

Contact resistance, or CRES, is one of those problems that most engineers prefer not to think about until it's staring them in the face. For years, it could be managed quietly with routine probe card cleaning or a scheduled socket swap. That approach worked well enough when pin counts were lower and devices pulled less current, but the ground has shifted since then. Today’s AI processors m... » read more

Data Feed Forward And How It Works: Part 2
By Roberto Colecchia - 09 Sep, 2025 - Comments: 0

As chiplets and advanced packaging redefine semiconductor architecture, managing complexity isn’t just about the silicon—it’s about the data. Modern multi-die packages often contain components from different vendors, integrated in 2.5D or 3D configurations. Each die brings its own risks, and diagnosing issues after assembly is increasingly difficult—especially when data isn’t share... » read more

Infusing Trust Into The Supply Chain
By Anne Meixner - 09 Sep, 2025 - Comments: 0

An expanding supply chain of dies feeding multi-die products is prompting chipmakers to reassess and expand on ways to instill trust from end to end. This reaches deeper than just connecting disparate data. It requires integrating complex systems across vendors and protecting vendor data while instilling confidence in their customers and partners. Yet despite the time and effort that has bee... » read more

Transforming Test For Co-packaged Optics
By Laura Peters - 12 Aug, 2025 - Comments: 0

Data centers are undergoing a dramatic transformation to reduce the power consumption of high-speed data transmissions by 70% or more with co-packaged optics. By moving optical transceivers from the fronts of racks into the same package as the networking switch and HBMs, AI programs that used to take a week to run can now be completed in a day. To enable this change in production manufacturi... » read more

Data Feed Forward And How It Works: Part 1
By Roberto Colecchia - 12 Aug, 2025 - Comments: 0

With data analytics, manufacturers can gain unparalleled insights into their testing processes, identify patterns, predict failures, and optimize operations. From improving yield rates to reducing testing costs, data analytics not only enhance the quality of semiconductor devices but also drives innovation and competitiveness in the industry. Traditionally, data analytics has been performed ... » read more

Chiplet Interfaces Embrace Failures
By Anne Meixner - 12 Aug, 2025 - Comments: 0

Redundancy in chiplet interfaces is now a prerequisite for achieving sufficient yield in high-performance computing devices, which today are packed with tens of thousands of interconnects. And as the number and density of those interconnects increases, the prospects for yield only worsen. For more than two decades, high-speed I/O interfaces have included reliability strategies to manage in-f... » read more

Easing The Stress For Package-Level Burn-In
By Laura Peters - 10 Jul, 2025 - Comments: 0

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and multi-chiplet packages become more common, and concerns about aging circuitry heighten, shifting stress testing to the wafer level looks increasingly attractive from a quality, throughput, and cost standp... » read more

The Data Dilemma In Semiconductor Testing And Why It Matters: Part 2
By Roberto Colecchia - 10 Jul, 2025 - Comments: 0

In Part 1, we explored the challenges of implementing machine learning and real-time analytics in semiconductor testing—chiefly, the difficulty of transferring device test data across multiple locations and organizations. In this post, we introduce Data Feed Forward (DFF) as it applies to ACS Advantest. What is ACS DFF? ACS DFF is a cloud-enabled solution designed to simplify, secure... » read more

Challenges In Using Sub-7nm ICs In Automotive
By Laura Peters - 10 Jun, 2025 - Comments: 0

The automotive industry is producing vehicles with increasing levels of real-time decision-making, enabled by thousands of ICs, sensors, and multi-chip packages, but making sure these systems work flawlessly throughout their expected lifetimes is a growing challenge. Automotive chips traditionally were developed at mature process nodes in five- to seven-year cycles, but much has changed over... » read more

Rethinking Chip Reliability For Harsh Conditions
By Gregory Haley - 10 Jun, 2025 - Comments: 0

As semiconductors push into environments once considered untenable, reliability expectations are being redefined. From the vacuum of space and the inside of jet engines to deep industrial automation and electrified drivetrains, chips now must endure extreme temperature swings, corrosive atmospheres, mechanical vibration, radiation, and unpredictable power cycles, all while delivering increasing... » read more

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