Leveraging Automotive Chip Design Techniques For Space-Borne Applications

By Synopsys - 27 Mar, 2024 - Comments: 0

Space-borne electronics must operate in an unforgiving environment with harsh conditions and little opportunity to repair failing components. A combination of functionally safe design, RHBD, and robust IP is required. Fortunately, automotive applications share many of the same challenges, and techniques to address these challenges are well established and proven. This white paper surveys the ma... » read more

Impact Of 3DHI On Aerospace And Government Applications

By Ian Land - 15 Feb, 2024 - Comments: 0

By Ian Land, Kenneth Larsen, and Rob Aitken With challenging size, weight, and power (SWaP) requirements, chip designs for aerospace, defense, and government applications are a unique breed. No surprise here, considering systems like satellites and submarines must operate reliably in the distinctly harsh environments of outer space and ocean depths, respectively. Given the SWaP criteria a... » read more

Industry Pressure Grows For Simulating Systems Of Systems

By Brian Bailey - 28 Sep, 2023 - Comments: 0

Most complex systems are designed in a top-down manner, but as the amount of electronic content in those systems increases, so does the pressure on the chip industry to provide high-level models and simulation capabilities. Those models either do not exist today, or they exist in isolation. No matter how capable a model or simulator, there never will be one that can do it all. In some cases,... » read more

MRAM Getting More Attention At Smallest Nodes

By Karen Heyman - 10 Aug, 2023 - Comments: 2

Magneto-resistive RAM (MRAM) appears to be gaining traction at the most advanced nodes, in part because of recent improvements in the memory itself and in part because new markets require solutions for which MRAM may be uniquely qualified. There are still plenty of skeptics when it comes to MRAM, and lots of potential competitors. That has limited MRAM to a niche role over the past couple de... » read more

An Update On 5G And Aircraft Safety

By Pete Gasperini - 10 Nov, 2022 - Comments: 0

The U.S. aircraft industry is in the final phases of adapting aircraft and airports to address concerns over potential 5G cellular signal interference of automated landing systems. The Federal Aviation Administration (FAA) has driven the process to determine the level of risk to aircraft and safeguard against problems for low-visibility approaches — such as during inclement weather — for ne... » read more

What You Need To Know About Qualifying Tools For DO-254 Programs

By Jacob Wiltgen - 03 Nov, 2022 - Comments: 0

By Michelle Lange and Tammy Reeve, Patmos Engineering Services, and Jacob Wiltgen, Siemens EDA DO-254, which is required for airborne electronics development, is a design assurance standard. Design assurance requires multiple layers of review and verification within the development process to ensure safe operation of the design being produced. This means when an engineer is doing design work... » read more

How Digital Twins Are Unlocking The Next Era Of Aerospace And Government Applications

By Ian Land - 31 Oct, 2022 - Comments: 0

By Ian Land, Jason Niatas, and Marc Serughetti Amidst changing economic waters and stringent manufacturing cycles, the aerospace, defense, and government landscape has seen an impressive technological evolution in the last few years. Innovations such as automating mission-critical systems and deploying advanced electronics in deep space exploration are expanding opportunities for government ... » read more

Verification Methodologies Evolve, But Slowly

By Brian Bailey - 29 Sep, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss digital twins and what is required to develop and verify new chips across a variety of industries, such as automotive and aerospace, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu ... » read more

Effects of Size Scaling and Device Architecture on the Radiation Response of Nanoscale MOS Transistors

By Technical Paper Link - 24 Aug, 2022 - Comments: 0

A new technical paper titled "Perspective on radiation effects in nanoscale metal–oxide–semiconductor devices" was published by a researcher at Vanderbilt University, Nashville, Tennessee. The work was partially supported by the Defense Threat Reduction Agency and by the U.S. Air Force Office of Scientific Research and Air Force Research Laboratory. According to the paper, "this Perspect... » read more

TCAD-Based Radiation Modeling Technique For Reliable Aerospace Chips

By Ian Land - 28 Jul, 2022 - Comments: 0

By Ian Land and Ricardo Borges We demand a lot from the electronic components that bring our devices and systems to life. This is particularly true when it comes to semiconductors for space applications. From satellites to spacecraft, aerospace and defense equipment must tolerate the most extreme of operating conditions in order to perform their jobs safely and reliably. How do you ensure... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.