All-In-One Analog AI Accelerator With CMO/HfOx ReRAM Integrated Into The BEOL (IBM Research-Europe)


A new technical paper titled "All-in-One Analog AI Hardware: On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices" was published by researchers at IBM Research-Europe. Abstract "Analog in-memory computing is an emerging paradigm designed to efficiently accelerate deep neural network workloads. Recent advancements have focused on either inference or training accelera... » read more

Roadmap for AI HW Development, With The Role of Photonic Chips In Supporting Future LLMs (CUHK, NUS, UIUC, Berkeley)


A new technical paper titled "What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips" was published by researchers at The Chinese University of Hong Kong, National University of Singapore, University of Illinois Urbana-Champaign and UC Berkeley. Abstract "Large language models (LLMs) are rapidly pushing the limits of contemporary computing hardware. For example, t... » read more

Optimizing Data Movement


Demand for new and better AI models is creating an insatiable demand for more processing power and much better data throughput, but it's also creating a slew of new challenges for which there are not always good solutions. The key here is figuring out where bottlenecks might crop up in complex chips and advanced packages. This involves a clear understanding of how much bandwidth is required ... » read more

Getting Real About AI Processors


There’s a lot of confusion and hype around AI. Nearly every service, product or subject area in the technology industry now has an AI label. A lot of this is valid and there’s no doubt that AI is opening up new capabilities and higher productivity across all industries. This white paper categorises AI and related hardware options, with a particular focus on on-device (i.e. edge) AI, givi... » read more

Scalable And Energy Efficient Solution for Hardware-Based ANNs (KAUST, NUS)


A new technical paper titled "Synaptic and neural behaviours in a standard silicon transistor" was published by researchers at KAUST and National University of Singapore. Abstract "Hardware implementations of artificial neural networks (ANNs)—the most advanced of which are made of millions of electronic neurons interconnected by hundreds of millions of electronic synapses—have achieved ... » read more

Cradle-To-Grave Analysis Of The Carbon Footprint of AI Hardware (Google)


A new technical paper titled "Life-Cycle Emissions of AI Hardware: A Cradle-To-Grave Approach and Generational Trends" was published by researchers at Google. Abstract "Specialized hardware accelerators aid the rapid advancement of artificial intelligence (AI), and their efficiency impacts AI's environmental sustainability. This study presents the first publication of a comprehensive AI acc... » read more

Analog Accelerator For AI/ML Training Workloads Using Stochastic Gradient Descent (Imperial College London)


A new technical paper titled "Learning in Log-Domain: Subthreshold Analog AI Accelerator Based on Stochastic Gradient Descent" was published by researchers at Imperial College London. Abstract "The rapid proliferation of AI models, coupled with growing demand for edge deployment, necessitates the development of AI hardware that is both high-performance and energy-efficient. In this paper, w... » read more

Novel NorthPole Architecture Enables Low-Latency, High-Energy-Efficiency LLM inference (IBM Research)


A new technical paper titled "Breakthrough low-latency, high-energy-efficiency LLM inference performance using NorthPole" was published by researchers at IBM Research. At the IEEE High Performance Extreme Computing (HPEC) Virtual Conference in September 2024, new performance results for their AIU NorthPole AI inference accelerator chip were presented on a 3-billion-parameter Granite LLM. ... » read more

Designing AI Hardware To Deal With Increasingly Challenging Memory Wall (UC Berkeley)


A new technical paper titled "AI and Memory Wall" was published by researchers at UC Berkeley, ICSI, and LBNL. Abstract "The availability of unprecedented unsupervised training data, along with neural scaling laws, has resulted in an unprecedented surge in model size and compute requirements for serving/training LLMs. However, the main performance bottleneck is increasingly shifting to memo... » read more

Research Bits: Dec. 18


Stacking 2D layers for AI processing Researchers from Washington University in St. Louis, MIT, Yonsei University, Inha University, Georgia Institute of Technology, and the University of Notre Dame demonstrated monolithic 3D integration of layered 2D material, creating a novel AI processing hardware that integrates sensing, signal processing, and AI computing functions into a single chip. Th... » read more

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