The Future Of FinFETs


The number of questions about finFETs is increasing—particularly, how long can they continue to be used before some version of gate-all-around FET is required to replace them. This discussion is confusing in many respects. For one thing, a 7nm finFET for TSMC or Samsung is not the same as a 7nm finFET for Intel or GlobalFoundries. There are a bunch of other nodes being proposed, as well, i... » read more

Predictions: Manufacturing, Devices And Companies


Some predictions are just wishful thinking, but most of these are a lot more thoughtful. They project what needs to happen for various markets or products to become successful. Those far reaching predictions may not fully happen within 2018, but we give everyone the chance to note the progress made towards their predictions at the end of the year. (See Reflection On 2017: Design And EDA and Man... » read more

Data Buffering’s Role Grows


Data buffering is gaining ground as a way to speed up the processing of increasingly large quantities of data. In simple terms, a data buffer is an area of physical [getkc id="22" kc_name="memory"] storage that temporarily stores data while it is being moved from one place to another. This becomes increasingly necessary in data centers, autonomous vehicles, and for [getkc id="305" kc_name=... » read more

Self-Driving Cars And Kobayashi Maru


Kobayashi Maru. If you know what I am talking about, you are a bona fide Star Trek fan. If not, let me indulge. Kobayashi Maru is a computer simulation for a training exercise in the fictional Star Trek universe, where Starfleet Academy cadets are presented with a no-win scenario. But they do have to make a decision. The primary goal of the exercise is to rescue a disabled civilian vessel... » read more

The Future Of AI Is In Materials


I had the pleasure of hosting an eye-opening presentation and Q&A with Dr. Jeff Welser of IBM at a recent Applied Materials technical event in San Francisco. Dr. Welser is Vice President and Director of IBM Research's Almaden lab in San Jose. He made the case that the future of hardware is AI. At Applied Materials we believe that advanced materials engineering holds the keys to unlocking... » read more

Packaging Challenges For 2018


The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

Auto Chip Test Issues Grow


By Jeff Dorsch & Ed Sperling Semiconductor suppliers are flocking to the automotive chip market to gain share in fitting out the connected car and the autonomous vehicle. But before those chips are sold to automotive manufacturers and Tier 1 suppliers, they must be tested and certified to meet stringent industry standards. This is no ordinary testing, though. Assisted and autonomous v... » read more

The Week in Review: IoT


Products/Services No matter the size of your button! You can now order up a flight on a private jet with the push of, yes, a button! GrandView Jets, an affiliate of GrandView Aviation, is bringing out a Web-enabled “Press for Jet” button, an Amazon Web Services Internet of Things button enabled by ButtonJoy Software. GrandView Jets says it has a fleet of Embraer Phenom 300 private jets to ... » read more

Can Autonomous Cars Get Around The Corner?


With all the buzz about autonomous vehicles, one big problem still remains. People and autonomous vehicles don't get along well together. Cars are predictable. People are not. Cars behave according to a predetermined set of rules. People look for opportunities and take them, even if they're sometimes not the wisest choice, such as passing around a blind curve or driving too fast on slippery ... » read more

Foundry Challenges in 2018


The silicon foundry business is expected to see steady growth in 2018, but that growth will come with several challenges. On the leading edge, GlobalFoundries, Intel, Samsung and TSMC are migrating from the 16nm/14nm to the 10nm/7nm logic nodes. Intel already has encountered some difficulties, as the chip giant recently pushed out the volume ramp of its new 10nm process from the second half ... » read more

← Older posts Newer posts →