IC Security Issues Grow, Solutions Lag


Experts at the Table: Semiconductor Engineering sat down to talk about the growing chip security threat and what's being done to mitigate it, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketing at Expedera; and Dave Kelf, CEO of Breker V... » read more

100G Ethernet At The Edge


The amount of data is growing, and so is the need to process it closer to the source. The edge is a middle ground between the cloud and the end point, close enough to where data is generated to reduce the time it takes to process that data, yet still powerful enough to analyze that data quickly and send it wherever it is needed. But to make this all work requires faster conduits for that data i... » read more

How Chip Engineers Plan To Use AI


Experts at the Table: Semiconductor Engineering sat down to discuss how AI is being used today and how engineers expect to use it in the future, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta; and David Pan, professor in the ... » read more

Week In Review: Semiconductor Manufacturing, Test


U.S. Senate Majority Leader Chuck Schumer said he launched an effort to establish rules on artificial intelligence to address national security and education concerns, Reuters reported. "Time is of the essence to get ahead of this powerful new technology to prevent potentially wide-ranging damage to society and national security and instead put it to positive use by advancing strong, bipartisan... » read more

Nightmare Fuel: The Hazards Of ML Hardware Accelerators


A major design challenge facing numerous silicon design teams in 2023 is building the right amount of machine learning (ML) performance capability into today’s silicon tape out in anticipation of what the state of the art (SOTA) ML inference models will look like in 2026 and beyond when that silicon will be used in devices in volume production. Given the continuing rapid rate of change in mac... » read more

Week In Review: Semiconductor Manufacturing, Test


The U.S. Commerce Department outlined proposed rules for the Chips for America Incentives Program, including additional details on national security measures applicable to the CHIPS Incentives Program included in the CHIPS and Science Act. The rules limit funding recipients from investing in the expansion of semiconductor manufacturing in foreign countries of concern, notably the People’s Rep... » read more

Options Widen For Optimizing IoT Designs


Creating a successful IoT design requires a deep understanding of the use cases, and a long list of tradeoffs among various components and technologies to provide the best solution at the right price point. Maximizing features and functions while minimizing costs is an ongoing balancing act, and the number of choices can be overwhelming. The menu includes SoC selection, OS and software proto... » read more

Trusted Sensor Technology For The Internet Of Things


“Data is the new oil” — Clive Humby, 2006 While this prediction relates to the value that can be generated from data, the focus here is on the tools at the oil well. Just as oil drilling platforms are expected to reliably produce crude oil around the clock, sensors are expected to reliably and continuously deliver high-quality data. But sensors have long since evolved from simple me... » read more

AI Becoming More Prominent In Chip Design


Semiconductor Engineering sat down to talk about the role of AI in managing data and improving designs, and its growing role in pathfinding and preventing silent data corruption, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta... » read more

Week In Review: Manufacturing, Test


TEL announced plans to build a ¥2.2 billion ($168.2 million) production and logistics center at its Tohoku Office to increase capacity. Construction of the 57,000m² facility, which will be used for manufacturing thermal processing and single-wafer deposition systems, is slated to start in spring 2024, and expected to be completed in fall 2025. Toshiba's board voted in favor of a 2 trillio... » read more

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