The Role Of AI And Endpoint Real-Time Data Analytics

By Kaushal Vora - 23 Jun, 2022 - Comments: 0

The Internet of Things (IoT) has the capability of amassing large amounts of data which it does with the help of dispersed intelligent sensors. The organization and distribution of this enormous amount of data is posing a challenge. While conventional methods of data analysis have facilitated the operations in IoT, artificial intelligence (AI) has proven that it can do it with greater precision... » read more

Audio, Visual Advances Intensify IC Design Tradeoffs

By Ann Mutschler - 13 Jun, 2022 - Comments: 0

A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

Can Analog Make A Comeback?

By Brian Bailey - 09 Jun, 2022 - Comments: 3

We live in an analog world dominated by digital processing, but that could change. Domain specificity, and the desire for greater levels of optimization, may provide analog compute with some significant advantages — and the possibility of a comeback. For the last four decades, the advantages of digital scaling and flexibility have pushed the dividing line between analog and digital closer ... » read more

Active Learning: Integrating Natural Intelligence Into Artificial Intelligence

By Oliver Gnepper - 09 Jun, 2022 - Comments: 0

Today, very few people would likely deny the fact that data can present major added value for companies. But analyzing data from production processes reveals the incompleteness of data collection and the associated reduced potential of the data that can be leveraged. Typical shortcomings include: Incomplete representation of processes in the dataspace, Inadequate connection of processes... » read more

DRAM Thermal Issues Reach Crisis Point

By Karen Heyman - 09 Jun, 2022 - Comments: 5

Within the DRAM world, thermal issues are at a crisis point. At 14nm and below, and in the most advanced packaging schemes, an entirely new metric may be needed to address the multiplier effect of how thermal density increasingly turns minor issues into major problems. A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does.... » read more

Chip Substitutions Raising Security Concerns

By Ed Sperling - 02 Jun, 2022 - Comments: 0

Substituting chips is becoming more common in the electronics industry as shortages drag on, allowing systems vendors to continue selling everything from cars to manufacturing equipment and printer cartridges without waiting for a commoditized part. But substitutions aren't always an even swap, and they increase security risks in ways that may take years to show up or fully understand. So fa... » read more

AI-Powered Verification

By Brian Bailey - 01 Jun, 2022 - Comments: 1

With functional verification consuming more time and effort than design, the chip industry is looking at every possible way to make the verification process more effective and more efficient. Artificial intelligence (AI) and machine learning (ML) are being tested to see how big an impact they can have. While there is progress, it still appears to be just touching the periphery of the problem... » read more

Is AI Improving A Broken Process?

By Brian Bailey - 26 May, 2022 - Comments: 0

Verification is fundamentally comparing two models, each derived independently, to find out if there are any different behaviors expressed between the two models. One of those models represents the intended design, and the other is part of the testbench. In an ideal flow, the design model would be derived from the specification, and each stage of the design process would be adding other deta... » read more

Enabling Big Chip AI Solutions Through Intelligent Clock Networks

By Aakash Jani - 26 May, 2022 - Comments: 0

Data centers, autonomous vehicles, and computer vision applications are pushing the limits of scalable AI compute. Data center chips face multi-trillion parameter models that continue growing every year. ADAS systems require flexibility and processing power for new model types, such as vision transformers. Edge AI solutions demand tight power budgets and the ability to process multiple models i... » read more

Will Big Competition Attract More Talent For IC Companies?

By Marie C. Baca - 26 May, 2022 - Comments: 1

Google is hiring a chip packaging technologist. General Motors is seeking a wafer fabrication procurement specialist. Facebook Reality Labs wants a materials researcher with experience in photolithography and nanoimprint techniques. Recent job postings by tech and automotive giants are enough to worry any chip company executive struggling to attract talent. But what may seem at first like a ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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