No Fooling With Voxel Pooling


A variety of new and complicated transformer models have emerged in the past 18 to 24 months as new “must have” networks in advanced automotive use cases. These novel architectures often introduce new network operators or novel ways of combining tensors – often from different types of sensors – in ways to enhance detection and recognition of objects in L3 / L4 / L5 ADAS and autonomous d... » read more

AI Semiconductors Require An Integrated Test Solution


The rapid proliferation of generative pre-trained transformers based on large language models (LLMs) is driving growth in the market for chips that can run the LLMs and other artificial intelligence (AI) and machine learning (ML) applications. Several types of chips hold promise for accelerating AI computing. Graphical processing units (GPUs) have proven to be capable solutions for the server/c... » read more

Three Key Reasons That The Future Of Smart Home Devices Is Embedded Contextual AI


Artificial intelligence has become a transformative force, reshaping how consumers interact with technology. Consumer-level AI tools like ChatGPT have set new benchmarks for smart home devices, raising expectations for seamless functionality, natural language interactions, and personalized user experiences. As consumers demand smarter, more intuitive devices, embedded engineers and system engin... » read more

The Price Of Fear


In my last blog, I talked about how pain is important when making predictions in the semiconductor industry. Pain is related to time to market and risk, and the flip side of risk is fear. Fear is one of the main drivers for a large number of EDA tools, such as those related to verification. The fear is taping out a chip, then waiting for what seems like an eternity to get the first chips bac... » read more

Improving Verification Methodologies


Methodology improvements and automation are becoming pivotal for keeping pace with the growing complexity and breadth of the tasks assigned to verification teams, helping to compensate for lagging speed improvements in the tools. The problem with the tools is that many of them still run on single processor cores. Functional simulation, for example, cannot make use of an unlimited number of c... » read more

AI’s Rapid Growth: The Crucial Role Of High Bandwidth Memory


System efficiency is dictated by the performance of crucial components. For AI hardware systems, memory subsystem performance is the single most crucial component. In this blog post, we will provide an overview of the AI model landscape and the impact of HBM memory subsystems on effective system performance. AI models have grown from a few billions of parameters from the early '90s to today�... » read more

Lines Blurring Between Supercomputing And HPC


Supercomputers and high-performance computers are becoming increasingly difficult to differentiate due to the proliferation of AI, which is driving huge performance increases in commercial and scientific applications and raising similar challenges for both. While the goals of supercomputing and high-performance computing (HPC) have always been similar — blazing fast processing — the mark... » read more

Key Challenges In Scaling AI Clusters


AI is evolving at an unprecedented pace, driving an urgent need for more powerful and efficient data centers. In response, nations and companies are ramping up investments into AI infrastructure. According to Forbes, AI spending from the Big Tech sector will exceed $250 billion in 2025, with the bulk going towards infrastructure. By 2029, global investments in AI infrastructure, including dat... » read more

What Scares Chip Engineers About Generative AI


Experts At The Table: LLMs and other generative AI programs are a long way away from being able to design entire chips on their own from scratch, but the emergence of the tech has still raised some genuine concerns. Semiconductor Engineering sat down with a panel of experts, which included Rod Metcalfe, product management group director at Cadence; Syrus Ziai, vice-president of engineering at E... » read more

Advanced Packaging Evolution: Chiplet And Silicon Photonics-CPO


As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing the advancements of any single semiconductor technology. This shift underscores the importance of heterogeneous integration (HI) as a crucial solution for alleviating bandwidth bottlenecks. Tod... » read more

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