tag: AI

Customization And Limitations At The Edge
By Ed Sperling - 10 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss the edge constraints and the need for security with Jeff DeAngelis, managing director of the Industrial and Healthcare Business Unit at Maxim Integrated; Norman Chang, chief technologist at Ansys; Andrew Grant, senior director of artificial intelligence at Imagination Technologies; Thomas Ensergueix, senior director of the automotive and IoT line of... » read more

Better Security, Lower Cost
By Ed Sperling - 10 Aug, 2020 - Comments: 0

For years, chipmakers have marginalized security in chips, relying instead on software solutions. Eventually that approach caught up with them, creating near panic in a scramble to plug weaknesses involving speculative execution and branch prediction, as well as the ability to read the data from chips with commercially available tools such as optical probes. There were several reasons for th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Aug, 2020 - Comments: 0

Chipmakers Nvidia is in advanced talks to acquire Arm from Softbank, according to numerous reports. In addition, TSMC and Foxconn are looking at possible investments or stakes in Arm, according to a report from Nikkei Asia Review. Infineon posted mixed results for the third quarter of the 2020 fiscal year. "Infineon has so far coped well with the challenging situation caused by the coronavi... » read more

Big Changes In AI Design
By Ed Sperling And Susan Rambo - 06 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss AI and its move to the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus; Kris Ardis, executive director at Maxim Integrated; Steve Roddy, vice president of Arm's Products Learning Group; and Vinay Mehta, inference technical marketing manager at Flex Logix. What follows are excerpts of that ... » read more

CodaCache: Helping to Break the Memory Wall
By Arteris - 04 Aug, 2020 - Comments: 0

As artificial intelligence (AI) and autonomous vehicle systems have grown in complexity, system performance needs have begun to conflict with latency and power consumption requirements. This dilemma is forcing semiconductor engineers to re-architect their system-on-chip (SoC) designs to provide more scalable levels of performance, flexibility, efficiency, and integration. From the edge to data ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 31 Jul, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT, 5G Qualcomm settled its 5G licensing disagreement with Huawei, which will pay $1.8 billion in back royalties and will pay for licensing going forward. Huawei is also now the world’s largest supplier of smartphones, surpassing Samsung Electronics Co. Qualcomm also announced a super-fast charging platform this week for Android devices that is sup... » read more

RISC-V Gaining Traction
By Ed Sperling - 30 Jul, 2020 - Comments: 0

Part 1: Semiconductor Engineering sat down to discuss where and why RISC-V is doing well, with Zdenek Prikryl, CTO of Codasip; Helena Handschuh, a Rambus Security Technologies fellow; Louie De Luna, director of marketing at Aldec; Shubhodeep Roy Choudhury, CEO of Valtrix Systems; and Bipul Talukdar, North America director of applications engineering at SmartDV. What follows are excerpt of that ... » read more

Memory Access In AI Systems
By Ed Sperling - 27 Jul, 2020 - Comments: 0

Memory access is a key consideration in AI system design. Ron Lowman, strategic marketing manager for IP at Synopsys, talks about how memory affects overall power consumption, why partitioning of on-chip and off-chip is so critical to performance and power, and how this changes from the cloud to the edge. » read more

eFPGAs Vs. FPGA Chiplets
By Ed Sperling - 22 Jul, 2020 - Comments: 0

Embedded FPGAs are a totally different concept from discrete FPGA chiplets, and that is reflected in size, cost, power and performance. Geoff Tate, CEO of Flex Logix, talks about which applications are best for each, how each maximizes power and performance, and why choices will vary greatly by application. Related eFPGA Knowledge Center FPGA Knowledge Center Increasing EFPGA Densit... » read more

Manufacturing Bits: July 21
By Mark LaPedus - 21 Jul, 2020 - Comments: 1

Intel’s next-gen MRAM At the recent 2020 Symposia on VLSI Technology and Circuits, Intel presented a paper on a CMOS-compatible spin-orbit torque MRAM (SOT-MRAM) device. Still in R&D, SOT-MRAM is a next-generation MRAM designed to replace SRAM. Generally, processors integrate a CPU, SRAM and a variety of other functions. SRAM stores instructions that are rapidly needed by the processo... » read more

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