How AiP/AoP Technology Helps Enable 5G And More


For 5G smartphones and other millimeter wave (mmWave) applications, antenna integration off the board and into the package, simplifies the design challenges endemic to high-frequency devices. These challenges include signal loss, signal integrity, and power supply limitation. Antenna in Package (AiP) and Antenna on Package (AoP) constructions provide the required form, fit and function for high... » read more

The Great Migration To 5G Is Underway


Every decade brings with it a plethora of technology changes, and the cumulative effects of 50+ years of changes in wireless technologies are noteworthy for how they have changed the way we communicate. The 80’s began the era of personal computing along with 1G rollout The 90’s saw the advent of 64-bit microprocessor architecture in consumer devices coinciding with 2G rollout The... » read more

Over-The-Air (OTA) Test Socket And Handler Integration Technology For 5G Mass Production Testing


This paper presents the integration of socket, measurement antenna and handler for over-the-air (OTA) testing of antenna-in-package (AiP) devices using automated test equipment (ATE) for 5G applications. The design and characteristics of sockets for performing OTA testing in the radiating near field are also discussed. The paper also describes the structure of OTA handler integration using thes... » read more

AiP/AiM Design For mmWave Applications — Advanced RF Front-End Design Flows From Concept To Signoff


System requirements for broad bandwidth, millimeter-wave (mmWave) spectrum, phased arrays, and integrated antennas and front-ends are evolving. The challenge for engineers will be achieving the cost, size, and performance requirements that will make these products commercially viable. All these factors align to drive next-generation component integration, which includes embedding the antenna wi... » read more

5G Chips Add Test Challenges


The advent of chips supporting millimeter-wave (mmWave) 5G signals is creating a new set of design and testing challenges. Effects that could be ignored at lower frequencies are now important. Performing high-volume test of RF chips will require much more from automated test equipment (ATE) than is required for chips operating below 6 GHz. “MmWave design is a pretty old thing,” said Y... » read more

Testing AiP Modules In High-Volume Production


Far-field and radiating near-field are two options for high-volume over-the-air (OTA) testing of antenna-in-package (AiP) modules with automated test equipment (ATE) [1]. In this article, we define an AiP device under test (DUT) and examine the measurement results from both methods. Creating an AiP evaluation vehicle Proper evaluation of an ATE OTA measurement setup requires an AiP module. Us... » read more