Chip Industry Week In Review

By The SE Staff - 13 Sep, 2024 - Comments: 0

Infineon rolled out the world's first 300mm gallium nitride (GaN) wafer, opening the door for high-volume manufacturing of GaN-based power semiconductors. A 300mm wafer contains 2.3 times as many chips per wafer as a 200mm wafer. Fig.1: Infineon's 300mm GaN wafer. Source: Infineon The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report th... » read more

Survey of Energy Efficient PIM Processors

By Technical Paper Link - 01 Aug, 2024 - Comments: 0

A new technical paper titled "Survey of Deep Learning Accelerators for Edge and Emerging Computing" was published by researchers at University of Dayton and the Air Force Research Laboratory. Abstract "The unprecedented progress in artificial intelligence (AI), particularly in deep learning algorithms with ubiquitous internet connected smart devices, has created a high demand for AI compu... » read more

Chip Industry Technical Paper Roundup: May 13

By Linda Christensen - 13 May, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=225 /] More ReadingTechnical Paper Library home » read more

Materials And Technologies For High Temperature, Resilient Electronics

By Technical Paper Link - 07 May, 2024 - Comments: 0

A technical paper titled “Materials for High Temperature Digital Electronics” was published by researchers at University of Pennsylvania, Air Force Research Laboratory, and Ozark Integrated Circuits. Abstract: "Silicon microelectronics, consisting of complementary metal oxide semiconductor (CMOS) technology, have changed nearly all aspects of human life from communication to transportatio... » read more

Research Bits: May 7

By Jesse Allen - 07 May, 2024 - Comments: 0

High-temperature memory Researchers from the University of Pennsylvania and Air Force Research Laboratory demonstrated memory technology capable of enduring temperatures as high as 600° Celsius for more than 60 hours while retaining stability and reliability. The non-volatile memory device consists of a metal–insulator–metal structure, incorporating nickel and platinum electrodes with a 4... » read more

Research Bits: October 3

By Jesse Allen - 03 Oct, 2023 - Comments: 0

Growing indium selenide at scale Researchers from the University of Pennsylvania, Brookhaven National Laboratory, and the Air Force Research Laboratory grew the 2D semiconductor indium selenide (InSe) on a full-size, industrial-scale wafer. It can also be deposited at temperatures low enough to integrate with a silicon chip. The team noted that producing large enough films of InSe has prove... » read more

Chip Industry’s Technical Paper Roundup: July 12

By Liz Allan - 12 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

A Photonic Circuit Architecture Allowing Faster, More Efficient Transfer of Large Amounts of Data

By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled "Massively scalable Kerr comb-driven silicon photonic link" was published by researchers at Columbia University and Air Force Research Laboratory. Abstract: "The growth of computing needs for artificial intelligence and machine learning is critically challenging data communications in today’s data-centre systems. Data movement, dominated by energy costs and limi... » read more

Gallium Oxide Power Electronic Roadmap

By Technical Paper Link - 18 Apr, 2022 - Comments: 0

New research paper addressing challenges in using gallium oxide. ABSTRACT "Gallium Oxide has undergone rapid technological maturation over the last decade, pushing it to the forefront of ultra-wide band gap semiconductor technologies. Maximizing the potential for a new semiconductor system requires a concerted effort by the community to address technical barriers which limit performance. Du... » read more

Week In Review: Design, Low Power

By Jesse Allen - 11 Mar, 2022 - Comments: 0

Intellectual Property Flex Logix inked an agreement with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) covering any Flex Logix IP technology for use in all US Government-funded programs for research and prototyping purposes with no license fees. “Our first license with AFRL for EFLX eFPGA in GlobalFoundries 12nm process was highly successful, with more than a half dozen pr... » read more

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