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Manufacturing Bits: June 1


Frozen finFETs The Defense Advanced Research Projects Agency (DARPA) has launched the Low Temperature Logic Technology (LTLT) program, an effort to develop finFETs that operate at temperatures close to liquid nitrogen (~77K or minus 321 degrees Fahrenheit). The goal of LTLT is to develop low-temperature finFET transistors at the 14nm node and below by making modifications to the manufacturi... » read more

Week In Review: Design, Low Power


Synopsys completed its acquisition of MorethanIP, a provider of Ethernet Digital Controller IP supporting data rates from 10G to 800G. The acquisition adds MAC (Medium Access Controller) and PCS (Physical Coding Sublayer) for 200G/400G and 800G Ethernet to Synopsys’ portfolio. The company also provides Time-Sensitive Networking, Fibre Channel, and Ethernet Switching IP for integration into AS... » read more

Manufacturing Bits: May 4


Measuring Moon dust The National Institute of Standards and Technology (NIST) and others have developed a new way to study and measure moon dust. Using an X-ray nano computed tomography (XCT) technique, researchers measured the 3D shapes of lunar particles as small as 400nm in length. The goal is to find out how these shapes impact the optical scattering characteristics of lunar dust on the... » read more

Manufacturing Bits: Sept. 22


Hairy nanoparticles The U.S. Air Force Research Laboratory is developing a new type of material called preceramic polymer-grafted nanoparticles or “hairy nanoparticles” (HNP). HNPs can be used to manufacture a new class of aircraft parts made of ceramic composite materials. An HNP is a hybrid material. It is based on a polymer shell, which is bound to a nanoparticle core, according to t... » read more

Week In Review: Manufacturing, Test


Chipmakers Jim Keller, senior vice president in the Technology, Systems Architecture and Client Group (TSCG) and general manager of the Silicon Engineering Group (SEG) at Intel, has resigned amid a major reorganization at the company. Here's one report about the situation. Cree as well as China’s Yutong Group and StarPower are working together to accelerate the commercial adoption of sili... » read more

Challenges In Printed And Disposable Chips


Printing inexpensive chips using technology developed for newspapers and magazines is gaining traction across a wide range of applications, from photovoltaic cells to sensors on a flexible substrate. But it's also adding a slew of new challenges that are unique to this approach. The world of flexible hybrid electronics (FHE) — printing integrated circuits on or attaching thin IC chips to a... » read more

Manufacturing Bits: Nov. 13


Power beams The U.S. Naval Research Laboratory and PowerLight Technologies have demonstrated the ability to transmit energy using a long-range, free-space power beaming system. The system is being developed as part of the Power Transmitted Over Laser (PTROL) project. The system consists of two 13-foot-high towers. One tower consists of 2-kilowatt laser transmitter. The other tower consist o... » read more

Week In Review: Manufacturing, Test


Fab tools A consortium of 31 companies have launched a new project, called the “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe.” The program is referred to as APPLAUSE. With a budget of 34 million euros, the project is being coordinated by ICOS, a division of KLA. “APPLAUSE will focus on advanced optics, photonics and electronics packagin... » read more

System Bits: Sept. 3


Microprocessor built with carbon nanotubes Researchers at the Massachusetts Institute of Technology were able to design a microprocessor with carbon nanotubes and fabricate the chip with traditional processes, an advance that could be used in next-generation computers. Work on producing carbon nanotube field-effect transistors has gone on for some time. Fabricated at scale, those CNFETs oft... » read more

Week in Review: IoT, Security, Autos


Products/Services Rambus reports completing its acquisition of Northwest Logic, a supplier of memory, PCIe, and MIPI digital controllers. Meanwhile, the company named Sean Fan as chief operating officer. He previously served as vice president and general manager of the data center business unit at Renesas Electronics. Prior to its acquisition by Renesas earlier this year, Fan held senior execu... » read more

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