Chip Industry Week In Review

By The SE Staff - 05 Jan, 2024 - Comments: 0

By Susan Rambo, Jesse Allen, and Liz Allan The U.S. government will provide about $162 million in federal incentives, under the CHIPS and Science Act, to help Microchip onshore its semiconductor supply chain. The move is aimed at securing a reliable domestic supply of MCUs and mature-node chips. “Today’s announcement will help propel semiconductor manufacturing projects in Colorado and O... » read more

A Design Flow For Critical Embedded Systems

By Arteris - 23 Aug, 2023 - Comments: 0

Learn how IP encapsulation/packaging and interoperability using IP-XACT enabled automation in a complex verification & validation flow for aeronautical systems. Includes usage of these capabilities integrated using Arteris SoC integration technology: HW/SW codesign RTL, SystemC TLM and PSL Instruction Set Simulators Click here to read more. » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 04 Aug, 2023 - Comments: 0

Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Power, Performance — Avionics Designers Want It All

By Heidi Elliott - 10 Jun, 2021 - Comments: 0

Not long ago, the prevailing philosophy among chip designers for aviation systems could be summed up as, “I feel the need — the need for speed.” Today, aviation’s top guns have pulled back on the throttle a bit. There’s a more nuanced discussion balancing the need for performance versus power, with other factors coming into consideration such as safety, security certifications and ove... » read more

Design For Airborne Electronics

By Ann Mutschler - 03 Feb, 2020 - Comments: 0

The Next Generation Air Transportation System (NextGen), an FAA-led modernization of America's air transportation system meant to make flying more efficient, predictable and safer, is currently underway as one of the most ambitious infrastructure projects in U.S. history. This is not just a minor upgrade to an aging infrastructure. The FAA and partners are in the process of implementing new ... » read more

July’19 Startup Funding

By Jeff Dorsch - 07 Aug, 2019 - Comments: 0

During the month of July, 21 technology startups took in mega-rounds of $100 million or more. Those companies together received more than $7.5 billion. On the other end of the financing spectrum, dozens of startups got seed funding or a Series A round. The dollar amounts were much smaller. Still, they are the beating heart of entrepreneurship around the world. It also was a month when som... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 25 Jan, 2019 - Comments: 0

Internet of Things Tony Franklin, Intel’s general manager for Internet of Things Segments, is interviewed by Lorin Fries on how the chipmaker is helping to develop smart farming applications. “We focus primarily on high-performance computer technologies, as well as communication technologies, which have great applicability for food systems. We work closely with a broad ecosystem of partner... » read more

Tech Talk: DO-254

By Ed Sperling - 24 Aug, 2017 - Comments: 0

Aldec's Louie De Luna explains the safety critical standard for the aerospace industry and how that parallels what's happening in automotive electronics. https://youtu.be/qa1g1NNVj60 » read more

The Week In Review: Manufacturing

By Mark LaPedus - 08 Jul, 2016 - Comments: 2

Fab materials/tools The Reference Project, a pan-European research program created to develop radio-frequency silicon-on-insulator (RF-SOI) technology, was recently launched at the Bernin, France-based facilities of Soitec. Soitec is the project leader in the group, which has an eligible budget of 33 million euros. The project will focus on developing technologies for 4G+ communications usi... » read more

Redefining Systems Around Power

By Ed Sperling - 06 Oct, 2011 - Comments: 0

By Ed Sperling Engineers have been talking about system-level power budgets since Moore’s Law reached 65nm, but as power becomes a critical element of any design with or without a plug the definition of what constitutes a system is changing. While most SoC engineers think of the system as an IC, power increasingly is playing a significant role in the subsystem, and even in the larger syst... » read more

Knowledge Centers
Entities, people and technologies explored

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters