Chip Industry Week In Review

By The SE Staff - 20 Dec, 2024 - Comments: 0

Updated for 12/20 government fundings and 12/23 for China trade investigation announcements. President Biden announced a trade investigation into "China's unfair trade practices in the semiconductor sector." The announcement stated "PRC semiconductors often enter the U.S. market as a component of finished goods. This Section 301 investigation will examine a broad range of the PRC’s non-m... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 3

By Archana Cheruliyil - 19 Dec, 2024 - Comments: 0

This is the third and final of a series from Alphawave Semi on HBM4 and gives and examines custom HBM implementations. Click here for part 1, which gives an overview of the HBM standard, and here for part 2, on HBM implementation challenges. This follows on from our second blog, where we discussed the substantial improvements high bandwidth memory (HBM) provides over traditional memory tec... » read more

Strain, Stress In Advanced Packages Drives New Design Approaches

By Ann Mutschler - 19 Dec, 2024 - Comments: 1

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, dependencies, and interactions, and driving demand for new tools. Unlike in the past, when various components were crammed into a planar SoC on a relatively thick substrate, the new substrates are bei... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 2

By Archana Cheruliyil - 09 Dec, 2024 - Comments: 0

This is the second in a three-part series from Alphawave Semi on HBM4 and gives insights into HBM implementation challenges. Click here for part 1, for an overview on HBM, and in part 3, we will introduce details of a custom HBM implementation. Implementing a 2.5D System-in-Package (SiP) with High Bandwidth Memory (HBM) is a complex process that spans across architecture definition, designi... » read more

Chip Industry Week In Review

By The SE Staff - 06 Dec, 2024 - Comments: 0

Global chips sales hit a record $56.9 billion in October, a 22% increase versus October 2023, according to the Semiconductor Industry Association. Also, global semiconductor equipment billings reached $30.38 billion in Q3 2024, a 19% YoY increase and 13% growth QoQ, SEMI reported. TSMC commenced equipment installation for its 2nm fab in Kaohsiung, Taiwan, six months ahead of schedule. The 2n... » read more

The Evolution of HBM

By Ed Sperling - 04 Dec, 2024 - Comments: 0

High-bandwidth memory originally was conceived as a way to increase capacity in memory attached to a 2.5D package. It has since become a staple for all high-performance computing, in some cases replacing SRAM for L3 cache. Archana Cheruliyil, senior product marketing manager at Alphawave Semi, talks about how and where HBM is used today, how it will be used in the future, why it is essential fo... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1

By Archana Cheruliyil - 26 Nov, 2024 - Comments: 1

This is the first of a three-part series on HBM4 and gives an overview of the HBM standard. Part 2 will provide insights on HBM implementation challenges, and part 3 will introduce the concept of a custom HBM implementation. Relentless growth in data consumption Recent advances in deep learning have had a transformative effect on artificial intelligence (AI) and the ever-increasing volume of ... » read more

Top-Down Vs. Bottom-Up Chiplet Design

By Ann Mutschler - 26 Nov, 2024 - Comments: 0

Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation. The case for chiplets is well understood. They can speed up time to market with consistent results, at whatever process node work... » read more

Chip Industry Week In Review

By The SE Staff - 01 Nov, 2024 - Comments: 0

Siemens announced plans to acquire Altair Engineering, a provider of industrial simulation and analysis, data science, and high-performance computing (HPC) software, for about $10 billion. Altair's software will become part of Siemens' Xcelerator portfolio and provide a boost to physics-based digital twins. Onto Innovation bought Lumina Instruments, a San Jose, California-based maker of lase... » read more

Chiplets Make Progress Using Interconnects As Glue

By Ann Mutschler - 31 Oct, 2024 - Comments: 0

Breaking up SoCs into their component parts and putting those and other pieces together in some type of heterogeneous assembly is beginning to take shape, fueled by advances in interconnects, complex partitioning, and industry learnings about what works and what doesn't. While the vision of plug-and-play remains intact, getting there is a lot more complicated than initially imagined. It can ... » read more

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Chip Industry Week In Review

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 3

Strain, Stress In Advanced Packages Drives New Design Approaches

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 2

Chip Industry Week In Review

The Evolution of HBM

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1

Top-Down Vs. Bottom-Up Chiplet Design

Chip Industry Week In Review

Chiplets Make Progress Using Interconnects As Glue

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