tag: Alphawave Semi

Chiplet Ecosystem Slowly Emerges
By Brian Bailey - 23 Jul, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss progress and remaining challenges for designing with chiplets with Mark Kuemerle, vice president of technology for Marvell; Letizia Giuliano, vice president for product marketing and management at Alphawave Semi; Hee-Soo Lee, HSD segment lead for Keysight; Mick Posner, senior product group director for Cadence’s Compute S... » read more

When Can I Buy A Chiplet?
By Brian Bailey - 17 Jul, 2025 - Comments: 1

One year ago, Semiconductor Engineering conducted its first roundtable to find out the true state of the industry for chiplets. At that event, it was stated that no chiplet had ever been reused in a design for which it was not initially intended. How much has changed over the past year? Returning from last year were Mark Kuemerle, vice president of technology for Marvell; Letizia Giuliano, vice... » read more

Distributing Intelligence Inside Multi-Die Assemblies
By Ed Sperling - 26 Jun, 2025 - Comments: 0

The shift from SoCs to multi-die assemblies requires more and smarter controllers to be distributed throughout a package in order to ensure optimal performance, signal integrity, and no downtime. In planar SoCs, many of these kinds of functions are often managed by a single CPU or MCU. But as logic increasingly is decomposed into chiplets, connected to each other and memories by TSVs, hybrid... » read more

Programmable Hardware Delivers 10,000X Improvement In Verification Speed Over Software For Forward Error Correction
By Tony Chan Carusone - 26 Jun, 2025 - Comments: 0

In the race to increase the speeds of wireline networking and communications, forward error correction (FEC) has become a vital part of the toolkit. To function effectively, especially with the increasing use of four-level pulse amplitude modulation (PAM4), high-speed protocols need FEC to avoid a rise in the number of reception errors. Each incremental increase in the transmitted symbol rate r... » read more

Chip Industry Week in Review
By The SE Staff - 13 Jun, 2025 - Comments: 0

The Chinese Academy of Sciences unveiled a fully automated processor chip design system, claiming the potential to accelerate semiconductor development and replace human programmers. Micron Technology plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, which is $30 billion higher than previously reported. AMD laun... » read more

Chip Industry Week in Review
By The SE Staff - 06 Jun, 2025 - Comments: 0

Qualcomm announced plans to buy Alphawave Semi for ~$2.4 billion in a deal expected to close in Q1 2026. Qualcomm plans to leverage Alphawave Semi's connectivity products, including chiplets, to develop high-performance, low-power solutions for AI inferencing and customized CPUs in data centers. Qualcomm's traditional targets were mobile phones and edge computing. [Updated 6/9.] Global semic... » read more

Accelerating Scalable Computing
By Shivi Arora - 02 Jun, 2025 - Comments: 0

By Shivi Arora and Sue Hung Fung As computing demands for HPC, AI/ML, and cloud infrastructure grow, modular architectures are replacing traditional monolithic System-on-Chip (SoC) designs. These legacy designs are increasingly expensive and difficult to scale due to ever-increasing silicon complexity. In response, the industry is embracing chiplet-based System-in-Package (SiP) solutions,... » read more

Optimizing Data Movement
By Ann Mutschler - 29 May, 2025 - Comments: 1

Demand for new and better AI models is creating an insatiable demand for more processing power and much better data throughput, but it's also creating a slew of new challenges for which there are not always good solutions. The key here is figuring out where bottlenecks might crop up in complex chips and advanced packages. This involves a clear understanding of how much bandwidth is required ... » read more

Optical Interconnectivity At 224 Gbps
By Ed Sperling - 28 May, 2025 - Comments: 0

AI is generating so much traffic that traditional copper-based approaches for moving data inside a chip, between chips, and between systems, are running out of steam. Just adding more channels is no longer viable. It requires more power to drive signals, and the distance those signals can travel without excessive loss is shrinking. Mike Klempa, product marketing specialist at Alphawave Semi, di... » read more

More Data, More Redundant Interconnects
By Ed Sperling - 19 May, 2025 - Comments: 0

The proliferation of AI dramatically increases the amount of data that needs to be processed, stored, and moved, accelerating the aging of signal paths through which that data travels and forcing chipmakers to build more redundancy into the interconnects. In the past, nearly all redundant data paths were contained within a planar chip using a relatively thick silicon substrate. But as chipma... » read more

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