tag: Alphawave Semi

Linear Drive Optics May Reduce Data Latency
By Karen Heyman - 11 Apr, 2024 - Comments: 0

Optical and electrical are starting to cross paths at a much deeper level, particularly with the growing focus on 3D-ICs and AI/ML training in data centers, driving changes both in how chips are designed and how these very different technologies are integrated together. At the root of this shift are the power and performance demands of AI/ML. It can now take several buildings of a data cente... » read more

The Data Crisis Is Unfolding — Are We Ready?
By Alphawave Semi - 27 Mar, 2024 - Comments: 0

The rapid advancement of technology has led to an unprecedented amount of data being generated, captured, and consumed globally. However, this reliance on data comes at a considerable cost. The widespread sharing and processing of data is necessary to navigate our everyday lives. Still, any disruption to this process can have severe consequences, threatening our ability to function as a society... » read more

3D-IC Intensifies Demand For Multi-Physics Simulation
By Ann Mutschler - 20 Mar, 2024 - Comments: 0

The introduction of full 3D-ICs will require a simultaneous analysis of various physical effects under different workloads, a step-function change that will add complexity at every step of the design flow, expand and alter job responsibilities, and bring together the analog and digital design worlds in unprecedented ways. 3D-ICs will be the highest-performance advanced packaging option, in s... » read more

Chip Industry Week In Review
By The SE Staff - 16 Feb, 2024 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan. Renesas plans to acquire Altium, maker of PCB design software, for $5.9 billion. In a conference call, Renesas CEO Hidetoshi Shibata cited Altium's PCB design software and digital twin virtual modeling as key components of its future strategy. "I believe it will generate transformational value for our combined customers and our stakeholders," Shib... » read more

SRAM Scaling Issues, And What Comes Next
By Karen Heyman - 15 Feb, 2024 - Comments: 0

The inability of SRAM to scale has challenged power and performance goals forcing the design ecosystem to come up with strategies that range from hardware innovations to re-thinking design layouts. At the same time, despite the age of its initial design and its current scaling limitations, SRAM has become the workhorse memory for AI. SRAM, and its slightly younger cousin DRAM, have always co... » read more

Chip Industry Week In Review
By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Dealing With Noise In Image Sensors
By Karen Heyman - 01 Feb, 2024 - Comments: 0

The expanding use and importance of image sensors in safety-critical applications such as automotive and medical devices has transformed noise from an annoyance into a life-threatening problem that requires a real-time solution. In consumer cameras, noise typically results in grainy images, often associated with poor lighting, the speed at which an image is captured, or a faulty sensor. Typi... » read more

Why There Are Still No Commercial 3D-ICs
By Brian Bailey - 29 Jan, 2024 - Comments: 0

Building chips in three dimensions is drawing increased attention and investment, but so far there have been no announcements about commercial 3D-IC chips. There are some fundamental problems that must be overcome and new tools that need to be developed. In contrast, the semiconductor industry is becoming fairly comfortable with 2.5D integration, where individual dies are assembled on some k... » read more

Dramatic Changes Ahead For Chips And Systems
By Karen Heyman - 21 Dec, 2023 - Comments: 0

Early this year, most people had never heard of generative AI. Now the entire world is racing to capitalize on it, and that's just the beginning. New markets, such as spatial computing, quantum computing, 6G, smart infrastructure, sustainability, and many more are accelerating the need to process more data faster, more efficiently, and with much more domain specificity. Compared to the days ... » read more

Chip Industry Week In Review
By The SE Staff - 15 Dec, 2023 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Synopsys acquired Imperas, pushing further into the RISC-V world with Imperas' virtual platform technology for verifying and emulating processors. Synopsys has been building up its RISC-V portfolio, starting with ARC-V processor IP and a full suite of tools introduced last month. The first high-NA EUV R&D center in the U.S. will be built at... » read more

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