Simplifying Integration And Security In Home Networks


An explosion of devices connected to the internet is driving vendors to implement standards that simplify the initial setup and improve security and integration with other devices, regardless of brand, network protocols, or country of origin. Farthest along in this multi-ecosystem merge is the Connectivity Standards Alliance (CSA), which today is supported by more than 500 companies, includi... » read more

Solving Problems With The IoT


The Internet of Things, a term once applied to almost any "smart" gadget connected to the Internet, is becoming more useful, more complex, and more of a security risk as the value of data continues to grow and more people depend on IoT technology. In the decades since the concept was first introduced, IoT devices have become so ubiquitous that applications cover practically every consumer, c... » read more

Why Matter 1.0 Really Matters


Incompatibilities of consumer devices inside the home are frustrating for consumers and a security risk. Skip Ashton, distinguished engineer at Infineon, talks about how the Matter 1.0 standard will fuse together different ecosystems from companies such as Apple, Google, and Amazon, how it will be applied to existing devices, what’s included and missing from the standard today, and how it can... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive And Mobility Two major auto OEMs revealed new electric vehicle models this week. The Audi Q8 e-tron has 40 driver assistance systems including five radar sensors, five cameras, and 12 ultrasonic sensors, and comes with either an 89 net kilowatt-hour battery or a 106 net kilowatt-hour battery. It arrives in the U.S. in April 2023. The Volvo EX90 contains both lidar and 5G connectivit... » read more

Fabless IDMs Redefine The Leading Edge


Large systems companies are looking more like integrated device manufacturers, designing their own advanced chips, packages, and systems for internal use. But because these are not pure-play chip companies, they are disrupting a 10-year cadence of customization and standardization that has defined the chip industry from its inception, and extending the period of innovation without the associate... » read more

Which Foundry Is In The Lead? It Depends.


The multi-billion-dollar race for foundry leadership is becoming more convoluted and complex, making it difficult to determine which company is in the lead at any time because there are so many factors that need to be weighed. This largely is a reflection of changes in the customer base at the leading edge and the push toward domain-specific designs. In the past, companies like Apple, Google... » read more

Bespoke Silicon Rattles Chip Design Ecosystem


Bespoke silicon developers are shaking up relationships, priorities, and methodologies across the semiconductor industry, creating demand for skills that cross traditional boundaries, and driving new business models that leverage these enormous investments. Bespoke silicon designers today are a rare breed, capable of understanding the unique requirements of a specific domain, as well as a gr... » read more

How To Compare Chips


Traditional metrics for semiconductors are becoming much less meaningful in the most advanced designs. The number of transistors packed into a square centimeter only matters if they can be utilized, and performance per watt is irrelevant if sufficient power cannot be delivered to all of the transistors. The consensus across the chip industry is that the cost per transistor is rising at each ... » read more

Week in Review: Auto, Security, Pervasive Computing


Automotive and Mobility Search engine giant Baidu said Monday it is the first company to secure permits to operate robotaxis in China without a human safety driver. Baidu’s Apollo and Toyota-backed Pony.ai already operate robotaxis with backup drivers in Beijing. Also this week, smartphone maker Xiaomi said it is running autonomous driving tests on 140 vehicles in China. Xiaomi announced it ... » read more

Blog Review: July 27


Siemens' Keith Felton expects a greater emphasis on several areas of semiconductor package design next year, including accelerated growth of heterogeneous integration, multiple die, and chiplet SiPs, emergence and adoption of organic-based interposers, and early detection of thermal and electromechanical issues. Cadence's Paul McLellan visits Imec to find out about getting the heat out of 3D... » read more

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