tag: AMD

Machine Learning Showing Up As Silicon IP
By Bryon Moyer - 03 Mar, 2022 - Comments: 0

New machine-learning (ML) architectures continue to appear. Up to now, each new offering has been implemented in a chip for sale, to be placed alongside host processors, memory, and other chips on an accelerator board. But over time, more of this technology could be sold as IP that can be integrated into a system-on-chip (SoC). That trend is evident at recent conferences, where an increasing... » read more

Building Multipurpose Systems With Dynamic Function Exchange Part Three: Tools For Deploying DFX
By Ed Rebello - 03 Mar, 2022 - Comments: 0

In our previous two articles, we introduced you to the concept of Dynamic Function Exchange (DFX), a design approach that dynamically reallocates unused system resources to other tasks. We also introduced you to some techniques for bundling and managing your DFX resources. In this article, we will discuss some of the adaptive computing tools that make DFX possible. As part of its investment ... » read more

Open RAN Direct RF Sampling Radio Transceiver Architectures For Massive MIMO
By AMD - 02 Mar, 2022 - Comments: 0

With the exponential increase in wireless traffic, mobile networks are transformed into more software-driven, virtualized, flexible, intelligent, and energy efficient systems. These trends have stimulated significant change in the core network with the advent of software defined networks (SDN) and network functions virtualization (NFV), which have enabled building more agile and less expensive ... » read more

Which Processor Is Best?
By Ed Sperling - 01 Mar, 2022 - Comments: 2

Intel's embrace of RISC-V represents a landmark shift in the processor world. It's a recognition that no single company can own the data center anymore, upending a revenue model that has persisted since the earliest days of computing. Intel gained traction in that market in the early 1990s with the explosion of commodity servers, but its role is changing as processors become more customized and... » read more

Data Center Architectures In Flux
By Ann Mutschler - 24 Feb, 2022 - Comments: 0

Data center architectures are becoming increasingly customized and heterogeneous, shifting from processors made by a single vendor to a mix of processors and accelerators made by multiple vendors — including system companies' own design teams. Hyperscaler data centers have been migrating toward increasingly heterogeneous architectures for the past half decade or so, spurred by the rising c... » read more

Transistors Reach Tipping Point At 3nm
By Mark LaPedus - 23 Feb, 2022 - Comments: 1

The semiconductor industry is making its first major change in a new transistor type in more than a decade, moving toward a next-generation structure called gate-all-around (GAA) FETs. Although GAA transistors have yet to ship, many industry experts are wondering how long this technology will deliver — and what new architecture will take over from there. Barring major delays, today’s GAA... » read more

Week In Review: Design, Low Power
By Jesse Allen - 18 Feb, 2022 - Comments: 0

AMD completed its acquisition of Xilinx. The all-stock deal ended up being valued at approximately $50 billion due to a rise in AMD's share price (the deal was valued at $35 billion when announced). The Xilinx business will become the newly formed Adaptive and Embedded Computing Group (AECG), led by former Xilinx CEO Victor Peng, and will continue its FPGA, adaptive SoC, and software roadmaps a... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 18 Feb, 2022 - Comments: 0

Automotive Renesas and AVL Software and Functions are collaborating to support developers of automotive ISO 26262-compliant electronic control units (ECUs). Renesas sells automotive R-Car SoCs, RH850 automotive control MCUs, PMICs, and software for levels ASIL B to ASIL D of ISO26262, but even with automotive ISO26262 parts, ECU system development process is never plug and play. Functional saf... » read more

Design Challenges Increasing For Mixed-Die Packages
By Ann Mutschler - 09 Feb, 2022 - Comments: 0

The entire semiconductor ecosystem is starting to tackle a long list of technology and business changes that will be needed to continue scaling beyond Moore's Law, making heterogeneous combinations of die easier, cheaper, and more predictable. There are a number of benefits to mixing die and putting them together in a modular way. From a design standpoint, this approach provides access to th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Feb, 2022 - Comments: 2

Government policy The Government of Quebec and IBM have announced a new partnership to establish Quebec as a technology hub in the development of quantum computing, artificial intelligence, semiconductors and high-performance computing. The two entities have formed the Quebec-IBM Discovery Accelerator. The new technology hub aims to focus on developing new projects, collaborations, and skills-... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy