tag: AMD

Getting The Right Return On Invested Power Consumption
By Frank Schirrmeister - 26 Feb, 2015 - Comments: 0

Three weeks ago, I participated in a panel on low power and modeling at the system level. It took place at DesignCon 2015 in Santa Clara, together with representatives from AMD, Avago, and Qualcomm. Interestingly enough, it gave me the opportunity to set some of the myths and dis-information about power consumption in emulation straight, but more on that later. The panel was moderated by Steve ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 23 Jan, 2015 - Comments: 0

The profile of a "tech geek" is typically a male. The label itself has transitioned from a negative to a positive connotation, according to new data from Crucial.com. In fact, almost half of women (45%) identified tech entrepreneurs as the most desirable potential spouse, compared to only 5% of women who would prefer a football player for a spouse. More than one in three women want a significan... » read more

Important Changes Ahead
By Steve Schulz - 12 Jan, 2015 - Comments: 0

Two of Si2's important industry standards efforts will be featured later this month at DesignCon, a popular Silicon Valley event that is now in its 20th year. In the panel entitled, "System-Level Power Modeling—What's the Big Deal?", leading industry experts from AMD, Avago Technologies, Cadence, Docea Power, Qualcomm, and Si2 will focus on the growing need to take a higher level and more... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Dec, 2014 - Comments: 0

This announcement could send some shock waves throughout the foundry business. For its baseband chips, Qualcomm uses several foundries, namely GlobalFoundries, Samsung and TSMC. Now, Qualcomm has another foundry partner. China’s Semiconductor Manufacturing International Corp. (SMIC) says that it has fabricated Qualcomm’s 28nm Snapdragon 410 processors. Snapdragon 410 is a processor that int... » read more

New Machine Tops The Green500 List
By Barry Pangrle - 10 Dec, 2014 - Comments: 0

The Green500 has released its latest list of the top 500 most energy efficient Supercomputers and there is a new machine, L-CSC from the Helmholtz Center that is the first supercomputer to surpass the 5 GigaFLOPS/watt barrier. The machine is yet another heterogeneous system and is based on AMD FirePro S9150 GPU accelerators and Intel Xeon E5-2690v2 10C 3GHz processors. IBM and NVIDIA aren’... » read more

An Inside Look At The GlobalFoundries-IBM Deal
By Ed Sperling - 20 Nov, 2014 - Comments: 3

GlobalFoundries' proposed acquisition of IBM Microelectronics is the kind of deal that will have business schools talking for many years to come—a gargantuan combination of expertise and technology, built on the back of high-profile business successes and failures, long-running legal struggles and global politics—with far-reaching implications for all parts of the semiconductor supply chain... » read more

System Design Enabling Surround Computing
By Frank Schirrmeister - 23 Oct, 2014 - Comments: 0

For a while now I have been wondering about the next killer application driving electronics. During CDNLive in Austin a couple of weeks ago, Dr. Lisa Su, at the time still Chief Operating Officer and since October 7th president and CEO at AMD, gave some answers at a keynote titled, “The Trends Redefining Our Industry.” The answer may well be “surround computing.” Su identified a coup... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Oct, 2014 - Comments: 0

It’s official: IBM appears to be exiting the chip business. After months of talks, IBM has agreed to pay GlobalFoundries $1.5 billion to take Big Blue’s chip unit off its hands, according to reports from Bloomberg. IBM will also receive $200 million worth of assets, according to the reports. At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel and IBM will present... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Oct, 2014 - Comments: 0

Samsung Electronics signed a memorandum of understanding to construct a new semiconductor fab in the company’s Godeok Industrial Complex in Pyeongtaek. The construction of the new semiconductor fabrication plant will begin during the first half of 2015, and operations are scheduled to begin sometime during the second half of 2017. United Microelectronics Corp. (UMC) will participate in a t... » read more

The Week In Review: Design
By Ed Sperling - 03 Oct, 2014 - Comments: 0

IP ARM introduced a new software platform and a free operating system aimed at IoT development. The OS incorporates security, communication and device management features for improved energy efficiency. The device server simplifies the connection and management of devices, incorporating security and improving efficiency. Cadence rolled out a broad IP portfolio for TSMC's 16nm platform, and ... » read more

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