tag: AMD

IP Market Shifts Direction
By Ed Sperling - 07 May, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss intellectual property changes and challenges with Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and MSIP at [getentity id="22035" e_name="Synopsys"]; Kurt Shuler, vice president of marketing at [getentity i... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Apr, 2015 - Comments: 0

It could be a long year for the equipment industry. First, Intel reduced its 2015 capital expenditure budget to $8.7 billion, plus or minus $500 million. This is down from the previous mid-point guidance of $10.1 billion. As a result of Intel’s announcement, Pacific Crest Securities cut its worldwide 2015 semiconductor CapEx forecast. The new CapEx forecast is now $62.5 billion in 2015. Th... » read more

Stacked Die, Phase Two
By Ed Sperling - 09 Apr, 2015 - Comments: 0

The initial hype phase of [getkc id="82" kc_name="2.5D"] appears to be over. There are multiple offerings in development or on the market already from Xilinx, Altera, Cisco, Huawei, IBM, AMD, all focused on better throughput over shorter distances with better yield and lower power. Even Intel has jumped on the bandwagon, saying that 2.5D will be essential for extending [getkc id="74" comment="M... » read more

First Time Success and Cost Control
By Brian Bailey - 01 Apr, 2015 - Comments: 0

First time success has been the ultimate goal for semiconductor companies due to escalating mask costs, as well as a guiding objective for the development of EDA tools, especially in the systems and verification space. These pressures are magnified for the [getkc id="76" comment="Internet of Things"] (IoT), especially the edge devices. Have system-level tools been able to contribute to first ti... » read more

First Time Success And Cost Control
By Brian Bailey - 13 Mar, 2015 - Comments: 0

First time success has been the ultimate goal for semiconductor companies due to escalating mask costs, as well as a guiding objective for the development of EDA tools, especially in the systems and verification space. These pressures are magnified for the [getkc id="76" comment="Internet of Things"] (IoT), especially the edge devices. Have system-level tools been able to contribute to first ti... » read more

First Time Success And Cost Control
By Brian Bailey - 26 Feb, 2015 - Comments: 0

First time success has been the ultimate goal for semiconductor companies due to escalating mask costs, as well as a guiding objective for the development of EDA tools, especially in the systems and verification space. These pressures are magnified for the [getkc id="76" comment="Internet of Things"] (IoT), especially the edge devices. Have system-level tools been able to contribute to first ti... » read more

Getting The Right Return On Invested Power Consumption
By Frank Schirrmeister - 26 Feb, 2015 - Comments: 0

Three weeks ago, I participated in a panel on low power and modeling at the system level. It took place at DesignCon 2015 in Santa Clara, together with representatives from AMD, Avago, and Qualcomm. Interestingly enough, it gave me the opportunity to set some of the myths and dis-information about power consumption in emulation straight, but more on that later. The panel was moderated by Steve ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 23 Jan, 2015 - Comments: 0

The profile of a "tech geek" is typically a male. The label itself has transitioned from a negative to a positive connotation, according to new data from Crucial.com. In fact, almost half of women (45%) identified tech entrepreneurs as the most desirable potential spouse, compared to only 5% of women who would prefer a football player for a spouse. More than one in three women want a significan... » read more

Important Changes Ahead
By Steve Schulz - 12 Jan, 2015 - Comments: 0

Two of Si2's important industry standards efforts will be featured later this month at DesignCon, a popular Silicon Valley event that is now in its 20th year. In the panel entitled, "System-Level Power Modeling—What's the Big Deal?", leading industry experts from AMD, Avago Technologies, Cadence, Docea Power, Qualcomm, and Si2 will focus on the growing need to take a higher level and more... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Dec, 2014 - Comments: 0

This announcement could send some shock waves throughout the foundry business. For its baseband chips, Qualcomm uses several foundries, namely GlobalFoundries, Samsung and TSMC. Now, Qualcomm has another foundry partner. China’s Semiconductor Manufacturing International Corp. (SMIC) says that it has fabricated Qualcomm’s 28nm Snapdragon 410 processors. Snapdragon 410 is a processor that int... » read more

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