Shaking Up The Green500


Barry Pangrle Last September, I wrote about the efficiency of IBM’s Power7+ architecture in my blog. IBM’s Sequoia supercomputer (a BlueGene/Q system) this past June had just shot to the top of the Supercomputing Top500 chart, clocking in at 16.32 petaflop/s on the Linpack benchmark. Other systems built around the IBM BlueGene/Q, Power BQC 16C 1.60GHz, Custom were also dominating the top o... » read more

Node Skipping Reaches New Heights


By Mark LaPedus For years, silicon foundries have rolled out their respective leading-edge processes roughly on a two-year cadence. The long-standing goal has been to keep foundry customers on a competitive price, power and performance curve. But as leading-edge chipmakers move from the 28nm node and beyond, the predictable process progression is changing. And the phenomenon of “node skip... » read more

New Incentives For Lowering Power


By Ed Sperling Despite all the focus by design teams on lowering power over the past few years, in many applications power is still the last consideration for many companies in the power-performance-area equation. That’s beginning to change, however, even for applications that in the past have not been particularly power-sensitive. There are several reasons for this shift. No. 1 on the li... » read more

ARM Vs. Intel, Phase Two


From 60,000 feet, ARM’s TechCon and the Intel Developer Forum look remarkably similar. The key message from both is a focus on improving performance in processors while significantly lowering power. Intel wants a piece of the mobile market so badly it can taste it. And ARM, which is the primary processing engine inside of the iPhone and one of a couple in Android-based devices—MIPS has ... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE
;1-4 OCT, NAPA


The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

AMD’s Bobcat Processor


Barry Pangrle The International Symposium on Low Power Electronics and Design (ISLPED) was held last week in Redondo Beach, California. There were many good presentations and keynote addresses and a topic that’s near to my heart, near-threshold voltage computing, was often discussed along with how best to (or not) handle variability. One paper out of many that caught my attention was The ... » read more

Capping Tools Tame Electromigration


By Mark LaPedus The shift towards the 28nm node and beyond has put the spotlight back on the interconnect in semiconductor manufacturing. In chip scaling, the big problem in the interconnect is resistance-capacitance (RC). Another, and sometimes forgotten, issue is electromigration. “Electromigration gets worse in device scaling,” said Daniel Edelstein, an IBM Fellow and manager of BE... » read more

SoC Platforms Gain Steam


By Ed Sperling Platforms are attracting far more attention from makers of SoCs because they are pre-verified and can speed time to market, but the shift isn’t so simple. It will spark major changes in the way companies design and build chips, causing significant disruption across the entire SoC ecosystem. Platforms are nothing new in the processor and software world. Intel, IBM AMD, and N... » read more

The 28nm Foundry Crunch


By Mark LaPedus Faced with huge and unforeseen demand at the 28nm node, leading-edge foundries are scrambling to play catch-up and are boosting their fab capacities at a staggering pace. But analysts warn that 28nm foundry capacity will be tight throughout 2012, and perhaps into 2013, putting some chipmakers in a pinch. Many blame the 28nm foundry capacity shortfall on a combination of t... » read more

Server Processor War Heats Up


By Kurt Shuler Yesterday’s announcement that Intel will acquire Cray’s interconnect hardware program, including IP and 74 employees, is the latest salvo in the race to develop commercially viable massively multicore server processors. On the surface, this acquisition seems like another instance of Intel beefing up its board-level interconnect technology, after having already acquired Fu... » read more

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