Chip Industry Week In Review

By The SE Staff - 22 Aug, 2025 - Comments: 0

The EU’s tariffs on semiconductors will not exceed 15%, according to Trump’s latest trade deal. In addition, the EU committed to purchasing at least $40 billion worth of U.S. AI chips as well as other investments. [FAQ is here.] Lifelines for Intel: Intel inked a deal to sell the U.S. government a 10% non-voting equity stake in its business, worth $8.9 billion. The stake will be fun... » read more

Transforming Test For Co-packaged Optics

By Laura Peters - 12 Aug, 2025 - Comments: 0

Data centers are undergoing a dramatic transformation to reduce the power consumption of high-speed data transmissions by 70% or more with co-packaged optics. By moving optical transceivers from the fronts of racks into the same package as the networking switch and HBMs, AI programs that used to take a week to run can now be completed in a day. To enable this change in production manufacturi... » read more

Chip Industry Week in Review

By The SE Staff - 08 Aug, 2025 - Comments: 1

Apple plans to increase its U.S. investment by an additional $100 billion over four years, which includes the launch of an advanced manufacturing supply chain program, spurring a number of related chip industry announcements, including: Apple will invest in Amkor's new packaging and test facility in Arizona as its first and largest customer, and Amkor will package and test Apple silicon pr... » read more

Can Cheaper Lasers Handle Short Distances?

By Bryon Moyer - 04 Aug, 2025 - Comments: 0

Optical technology is well established for long-haul communications, but the distances it serves are shrinking — especially in the data center. Vertical-cavity surface-emitting lasers (VCSELs) already drive short fiber links. But efforts are underway to further scale them down to provide more connections through waveguides than fiber can provide. “We have seen the transition from long... » read more

Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces

By MinJae Kong - 24 Jul, 2025 - Comments: 0

In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is expected to continue, with expansion into areas such as central processing units (CPUs), artificial intelligence (AI) systems, and automotive products. Flip chip lidded ball grid array (FCLBGA) pa... » read more

The Rise Of Panel-Level Packaging

By Laura Peters - 24 Jul, 2025 - Comments: 0

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum reticle size in the next few years. These assemblies are best developed using fan-out panel-level packaging, replacing today’s wafer carrier with a panel. Fan-out packaging enables substantially... » read more

Chip Industry Week in Review

By The SE Staff - 27 Jun, 2025 - Comments: 0

AI featured big at this week's Design Automation Conference (DAC) in San Francisco. Dozens of companies featured AI-related tools (see product section below), as well as significant improvements to existing tools and some entirely new approaches for designing chips. Among the highlights: Siemens unveiled an AI-enhanced toolset for the EDA design flow that enables customers to integrate the... » read more

Power Delivery Challenges For AI Chips

By Gregory Haley - 19 Jun, 2025 - Comments: 0

As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But delivering this power efficiently and reliably, without degrading signal integrity or introducing thermal bottlenecks, has created some of the toughest design and manufacturing challenges in semiconducto... » read more

Physics Limits Interposer Line Lengths

By Bryon Moyer - 19 Jun, 2025 - Comments: 1

Electrical interposers provide a convenient surface for mounting multiple chips within a single package, but even though interposer lines theoretically can be routed anywhere, insertion losses limit their practical length. Lines on interposers — and on silicon interposers in particular — can be exceedingly narrow. Having a small cross-section makes such lines resistive, degrading signals... » read more

2024 Corporate Responsibility Report

By Amkor - 19 Jun, 2025 - Comments: 0

Amkor recognizes the need for transparent reporting, and we have been publishing annual reports to facilitate the disclosure of comparable, consistent, and reliable information about our initiatives and progress for our stakeholders. Last year, we verified our targets to achieve net-zero greenhouse gas emissions by 2050, including near-term targets, with the Science Based Targets initiative ... » read more

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tag: Amkor

Chip Industry Week In Review

Transforming Test For Co-packaged Optics

Chip Industry Week in Review

Can Cheaper Lasers Handle Short Distances?

Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces

The Rise Of Panel-Level Packaging

Chip Industry Week in Review

Power Delivery Challenges For AI Chips

Physics Limits Interposer Line Lengths

2024 Corporate Responsibility Report

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