Week In Review: Design, Low Power

By Jesse Allen - 18 Oct, 2019 - Comments: 0

Allegro DVT acquired Amphion Semiconductor, bringing together two developers of video codec IP. Allegro DVT said the merger will make it the first semiconductor IP company to offer commercially available hardware-based, real-time encoder and decoder solutions for the new AV1 video encoding format for SoC implementations, supporting 4K/UHD up to 8K. Based in Belfast, Northern Ireland, Amphion wa... » read more

Week In Review: Design, Low Power

By Jesse Allen - 17 May, 2019 - Comments: 0

Tools & IP Cadence introduced the Tensilica Vision Q7 DSP, which provides up to 1.82 TOPS and is specifically optimized for simultaneous localization and mapping (SLAM). The DSP has a very long instruction word (VLIW) SIMD architecture, an enhanced instruction set supporting 8/16/32-bit data types and optional VFPU support for single and half precision, and a number of iDMA enhancements in... » read more

Preparations for DAC

By Brian Bailey - 27 May, 2016 - Comments: 1

The 53rd DAC is just days away now and the program is pretty well established at this point. It is returning to Austin after a couple of years in San Francisco. In 2013 it was held in this location for the first time and there was a herculean effort to bring the local design community to the event. They did amazing well and while attendance fell slightly compared to the previous year in San Die... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Amphion Semiconductor

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Preparations for DAC