Week In Review: Design, Low Power

By Jesse Allen - 09 Jul, 2021 - Comments: 0

Tools Aldec extended its TySOM family of embedded prototyping boards with the introduction of TySOM-M-MPFS250, the first in a planned series to feature a Microchip PolarFire SoC FPGA MPFS250T-FCG1152 and to have dual FMC connectivity. The board contains 16Gb FPGA DDR4 x32, 16Gb MSS DDR4 x36 with ECC, eMMC, SPI Flash memory, 64 Kb EEPROM and a microSD card socket. The PolarFire SoC is a five-st... » read more

CXL Signals A New Era Of Data Center Architecture

By Tim Messegee - 08 Jul, 2021 - Comments: 0

An exponential rise in data volume and traffic across the global internet infrastructure is motivating exploration of new architectures for the data center. Disaggregation and composability would move us beyond the classic architecture of the server as the unit of computing. By separating the functional components of compute, memory, storage and networking into pools, composed on-demand to matc... » read more

Week In Review: Design, Low Power

By Jesse Allen - 18 Jun, 2021 - Comments: 0

Rambus is making a push for Compute Express Link (CXL) with two acquisitions and the launch of its CXL Memory Interconnect Initiative. The initiative aims to define and develop semiconductor solutions for advanced data center architectures, with initial research and development focusing on solutions to support key memory expansion and pooling use cases. CXL is an open interconnect specificat... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 18 Jun, 2021 - Comments: 0

Automotive U.S. electric truck manufacturer Lordstown Motors has an electric truck but after a large buyer fell through, it admitted it does not have any firm orders on its trucks, according to an AP story. The CEO and CFO resigned earlier this week. The electric car company Canoo announced its US manufacturing facility will be in Oklahoma. Cadence revealed its Tensilica FloatingPoint DSP (... » read more

Week In Review: Design, Low Power

By Jesse Allen - 16 Apr, 2021 - Comments: 0

Siemens Digital Industries Software will acquire OneSpin Solutions, a provider of formal verification tools. The company's portfolio of formal tools and apps covers a wide range of design verification, equivalence checking, and functional safety, as well as solutions for trust and security checking. Siemens plants to add OneSpin's technology to the Xcelerator portfolio of verification tools. ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 05 Feb, 2021 - Comments: 0

Tools & IP Synopsys is joining Microsoft in the U.S. Department of Defense's Rapid Assured Microelectronics Prototypes (RAMP) program to support the development of IC hardware and workflow prototypes that incorporate Synopsys' assured design and manufacturing flows into Microsoft Azure. The RAMP program aims to bring commercial capabilities and speed to the development of semiconductors fo... » read more

Week In Review: Design, Low Power

By Jesse Allen - 24 May, 2019 - Comments: 0

M&A Marvell will acquire Avera Semiconductor, the ASIC business of GlobalFoundries, for $650 million in cash at closing plus an additional $90 million in cash if certain business conditions are satisfied within the next 15 months. The agreements include transfer of Avera's revenue base, strategic design wins with infrastructure OEMs, and a new long-term wafer supply agreement between Globa... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: AnalogX

Week In Review: Design, Low Power

CXL Signals A New Era Of Data Center Architecture

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

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