tag: ANSYS

ANSYS HFSS and SGI UV 2000 Takes Electromagnetic Simulation To New Heights
By Ansys - 09 Sep, 2015 - Comments: 0

This white paper discusses how the latest version of ANSYS HFSS (Release 16) takes full advantage of the SGI UV2000 advanced symmetric multiprocessing (SMP) system to achieve these objectives. Utilizing SGI’s sixth generation technology, engineers and scientists can leverage hundreds of processing cores and terabytes of coherent shared memory to solve very large EM field simulations, as well ... » read more

Blog Review: Sept. 2
By Jesse Allen - 02 Sep, 2015 - Comments: 0

When it comes to cars, manufacturers may be adding too many features too fast, says Mentor's John Day. Up to half of the features may never get used either because they aren't useful or they are too complex. Cadence's Christine Young sat down with Neeti Bhatnagar, a software engineering group director to discuss the challenges and rewards of working in a distributed, cross-functional team, t... » read more

Blog Review: Aug. 26
By Jesse Allen - 26 Aug, 2015 - Comments: 0

Synopsys' Marc Greenberg attended IDF and learned more about the newly announced Intel/Micron 3D XPoint memory technology named Optane including initial ship dates and some implementation details. In concluding his analysis of the 2014 Functional Verification Study, Mentor's Harry Foster reveals an unexpected finding about design size and respins. How do you keep your power grid from bein... » read more

The Week In Review: Design/IoT
By Jesse Allen - 21 Aug, 2015 - Comments: 0

Chips Rambus moved into the fabless market with the announcement that it is developing memory controller chips, expanding the company's business beyond just creating IP for the memory and security markets. Read Ed Sperling's full analysis. Standards Accellera updated the Standard Co-Emulation Modeling Interface (SCE-MI). The newest version of the standard, SCE-MI 2.3, expands the set o... » read more

Blog Review: Aug. 19
By Jesse Allen - 19 Aug, 2015 - Comments: 1

Several of this week's top reads from Ansys' Justin Nescott sound like they're straight from the pages of sci-fi novels (and comic books). An MIT project is getting close to creating the Iron Man suit, one company plans to finally build a space elevator, and Los Angeles takes an innovative approach to fighting the California drought: 96 million black plastic balls. Smartphones are so yestery... » read more

Tackling RF Desense Challenges At The Source
By Margaret Schmitt - 14 Aug, 2015 - Comments: 0

Just imagine you are stepping out of the electronics store with your brand new smart phone. You eagerly scroll down your contacts to dial your best friend and proudly tell them the great news, but as soon as they pick up, your reception is gone! What happened? This problem is commonly described as desense, a degradation of the sensitivity of the receiver due to external noise sources. Desens... » read more

DVFS On The Sidelines
By Brian Bailey - 13 Aug, 2015 - Comments: 2

Power reduction is one of the most important aspects of chip design these days, but not all power reduction techniques are used equally. Some that were once important are fading and dynamic voltage, and frequency scaling (DVFS) is one of them. What's changed, and will we see a resurgence in the future? What is it? DVFS has physics powerfully in its favor. As Vinod Viswanath, director of res... » read more

2.5D Creeps Into SoC Designs
By Ed Sperling - 13 Aug, 2015 - Comments: 0

A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

Blog Review: Aug. 12
By Jesse Allen - 12 Aug, 2015 - Comments: 0

SIM cards are protected by AES-128, which is supposed to be virtually unbeatable by a brute-force attack. But there's still a weakness: Rambus' Aharon Etengoff reports on how a researcher at Jiao Tong University exploited side-channel attack techniques to crack the encryption codes protecting 3G and 4G SIM cards. After recent reports on compromised car security, auto makers are likely search... » read more

Blog Review: Aug. 5
By Jesse Allen - 05 Aug, 2015 - Comments: 0

Fresh from the July 2015 Type-C InterOp Event, where USB engineers wheel a prototype on a cart from hotel room to hotel room, testing interoperability, Synopsys' Morten Christiansen says Type-C has arrived. Mentor's Colin Walls discusses the reasons to tackle embedded software development with a bottom-up approach. In their latest video, Cadence's Kishore Kasamsetty discusses why choose L... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy