Blog Review: September 13


Siemens' Todd Westerhoff highlights the importance of signal integrity analysis in PCB design, challenges as simulation tools have become more sophisticated and difficult to use, and best practices like starting with a simple analysis problem. Synopsys' Rita Horner, Shekhar Kapoor, and William Ruby note that the power and thermal profiles of multi-die systems for HPC and the data center shou... » read more

Fab And Field Data Transforming Manufacturing Processes


The ability to capture, process, and analyze data in the field is transforming semiconductor metrology and testing, providing invaluable insight into a product's performance in real-time and under real-world conditions and use cases. Historically, data that encapsulates parameters such as power consumption, temperature, voltages, currents, timing, and other characteristics, was confined to d... » read more

Chip Industry Week In Review


By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with Q1, according to SEMI. Similarly, the top 10 semiconductor foundries reported a 1.1% quarterly-over-quarter revenue decline in Q2. A rebound is anticipated in Q3, according to TrendForce. Synopsys extended its AI-driven EDA ... » read more

Designing Vehicles Virtually


The shift toward software-defined vehicles (SDVs), electric vehicles (EVs), and ultimately autonomous vehicles (AVs) is proving the value and exposing the weaknesses in simulating individual components and complete vehicles. The ability to model this intensely complex maze of real-world interactions and possible scenarios is improving, and it's happening faster than comparable road-testing o... » read more

Blog Review: September 6


Cadence's Reela Samuel listens in as industry experts discuss whether generative AI-powered tools could facilitate the creation of diverse chip types and address talent shortages by creating  a more accessible entry point for those interested in circuit, chip, or system design. Synopsys' Ian Land, Jigesh Patel, and Kenneth Larsen find that the way that today’s government, aerospace, and d... » read more

Automotive Complexity, Supply Chain Strength Demands Tech Collaboration


The automotive supply chain is becoming more complex and collaborative, changing longstanding relationships between automakers and their suppliers in ways that would have seemed unimaginable even a couple of years ago. Rather than just developing parts for a tightly defined specification, suppliers are taking an increasingly active role in determining how various technologies are combined, w... » read more

Blog Review: August 30


Siemens' Dan Yu examines hallucinations in large language models, the Universal Approximation Theorem, and the role they play in applying LLMs to EDA. Cadence's Mamta Rana introduces shared flow control in PCIe 6.0, which enables the reduced cost implementation of multiple virtual channels by allowing common sets of resources to be shared. Synopsys' Arturo Salz and Johannes Stahl note tha... » read more

Optimizing IC Designs For Real-World Use Cases


Semiconductor systems are becoming more focused on power, performance, and area for the primary scenarios they are likely to see in real-world applications, but increasingly at the expense of secondary tasks. This is happening at all levels of abstraction and all stages of the design flow. At the highest level, processors are being optimized to run a given set of software. RISC-V is one of t... » read more

Blog Review: Aug. 23


Siemens' Stephen Chavez discusses best practices when it comes to thermal analysis for PCB design, including component placement and close collaboration between mechanical and electrical engineering disciplines. Synopsys' Gary Ruggles, Richard Solomon, and Varun Agrawal introduce the Compute Express Link (CXL) specification and how it could help improve latency through computational offloadi... » read more

Blog Review: Aug. 16


Synopsys' Johannes Stahl and Tim Kogel suggest that multi-die systems require a new approach at the architecture planning phase and why chip designers can’t ignore physical effects such as layout, power, temperature, or IR-drop. Siemens' Rich Edelman argues for using the waveform window in a GUI rather than $display when debugging UVM. Cadence's Paul Scannell stresses the need for diver... » read more

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